Cisco Technology, Inc.

Sioptical, Inc.

Lightwire, Inc.

Other

Aayuna Inc.

Saras-3d, Inc.

Gothoskar, Prakash

Ghiron, Margaret

Montgomery, Robert Keith

Pathak, Soham

Patel, Vipulkumar

Shastri, Kalpendu

Yanushefski, Katherine A.

Piede, David

Kalpendu Shastri

Soham Pathak

Vipulkumar K Patel

Prakash B Gothoskar

Robert Keith Montgomery

Margaret Ghiron

Bipin Dama

Katherine A Yanushefski

Mark Andrew Webster

Kishor V Desai

Ravinder Kachru

David Piede

Rao Yelamarty

Anujit Shastri

Neeraj Kumar Dubey

Alan Leonhartsberger

Sean P Anderson

Ravi Sekhar Tummidi

Utpal Kumar Chakrabarti

Paulius Mosinskis

Thomas Robert Daugherty

Rutvij Dave

Gnyaneshwar Ramakrishna

Kaushik Patel

Chris Togami

Peter C Metz

Mary Nadeau

John Matthew Fangman

Russell Romano

Harvey L Wagner

David Snyder

Raymond Nering

Ankita Shastri

Sriram Tyagarajan

Paulius Mindaugas Mosinskis

Prakash Gothoskar

Vipulkumar Patel

Passive alignment and connection between a fiber array and a plurality of optical waveguides terminating along an edge of a photonic IC (PIC) is provided by a controlled mating between alignment V-grooves formed in a fiber array support substrate and extra-array alignment ridges formed beyond the extent of a waveguide array integrated within the PIC. The height and width of the alignment ridges are formed to engage with the alignment V-grooves upon mating of the fiber array substrate with the PIC, providing passive alignment while maintaining a physical gap spacing g between the components (ensuring the integrity of the passive alignment).

Passively-aligned fiber array to waveguide configuration

A dual-layer coupling arrangement comprises a first coupling waveguide disposed within a photonic integrated circuit (at a position over an included optical signal waveguide) and a second coupling waveguide disposed above the first coupling waveguide. The first and second coupling waveguides are formed to exhibit splitter configurations that terminate as a pair arms separated by a distance suitable for creating beams that would coincide with a circular mode field of the core region of a coupling optical fiber. The vertical spacing between the first and second coupling waveguides is set so that the pairs of beams exiting from the terminating arms of the coupling waveguides coincide with a circular mode field.

Dual layer optical coupling configuration between photonic integrated circuit and external single mode optical fiber

Passive alignment and connection between a fiber array and a plurality of optical waveguides terminating along an edge of a photonic IC is provided by a controlled mating between V-grooves formed in a fiber support substrate and alignment ridges formed to surround waveguide terminations along an edge of a photonic IC. The V-grooves of the fiber support substrate are spaced to define the same pitch as the waveguides on the photonic IC, with the height and width of the alignment ridges formed to engage with the V-grooves upon mating of the fiber support substrate with the photonic IC. The individual fibers are positioned within associated V-grooves such that their endfaces are retracted from a proximal end portion of the support structure. It is this proximal end portion that mates with the alignment ridges on the photonic IC.

A 2D/3D conversion interface component is configured to override the video processing capabilities associated with a conventional 2D display, re-formatting an incoming 3D video stream into a version compatible with a 2D display while preserving the 3D-type of presentation. An incoming 'side-by-side' (SBS) 3D video stream is re-formatted into a 'frame sequential' (serialized) format that appears as a conventional video stream input to the 2D display. The interface component also generates as an output a timing signal (synchronized with the converted frames) that is transmitted to a 3D viewing device (e.g., glasses). Therefore, as along as the 3D viewing device remains synchronized with the sequence of frames shown on the 2D display, the user will actually be viewing an interactive 3D video.

User interface module for converting a standard 2D display device into an interactive 3D display device

A high density interconnect arrangement takes the form of a backplane-pluggable card, with electrical connections formed along a single (pluggable) edge and all remaining connections provided via optical fibers. An exemplary interconnect arrangement also includes on-board optical sources and silicon photonic-based circuitry for providing optical transceiver functionality. Passively aligned fiber arrays are utilized to provide I/O connections to external elements, as well as between laser sources and on-board silicon photonics.

High density opto-electronic interconnection configuration utilizing passive alignment

An optical demultiplexer that includes at least one a hybrid phase shifter configured to receive a light signal over a fiber element, the light signal including polarized optical signals. Each phase shifter includes a thermo-optic phase shifter configured to phase shift the light signal, an electro-optic phase shifter configured to phase shift the light signal, and a coupler configured to maintain polarization of the polarized signal components. The optical demultiplexer also includes control circuitry configured to regulate the thermo-optic and electro-optic phase shifters.

Silicon photonic hybrid polarization demultiplexer

Embodiments herein include an optical system, an optical component, and an associated method of passive alignment in which complementary magnetic patterns are used to provide passive alignment between optical elements. The magnetic coupling between the magnetic patterns operates to align optical elements in at least two dimensions. The magnetic coupling provides a temporary holding force on the optical elements until the optical elements are secured using epoxy or other adhesive.

Alignment of optical components using nanomagnets

An opto-electronic assembly is provided comprising a substrate (generally of silicon or glass) for supporting a plurality of interconnected optical and electrical components. A layer of sealing material is disposed to outline a defined peripheral area of the substrate. A molded glass lid is disposed over and bonded to the substrate, where the molded glass lid is configured to create a footprint that matches the defined peripheral area of the substrate. The bottom surface of the molded glass lid includes a layer of bonding material that contacts the substrate's layer of sealing material upon contact, creating a bonded assembly. In one form, a wafer level assembly process is proposed where multiple opto-electronic assemblies are disposed on a silicon wafer and multiple glass lids are molded in a single sheet of glass that is thereafter bonded to the silicon wafer.

Molded glass lid for wafer level packaging of opto-electronic assemblies

Embodiments herein include an optical system that passively aligns an optical component (e.g., a fiber array connector, lens array, lens body, etc.) with a semiconductor substrate using trenches that mate with optical fiber stubs. In one embodiment, the trenches are etched into the semiconductor substrate which provides support to optical devices (e.g., lasers, lens arrays, photodetectors, etc.) that transmit optical signals to, or receive optical signals from, the optical component. An underside of the optical component is etched to include at least two grooves (e.g., V-grooves) for receiving optical fiber stubs. In one embodiment, the optical fiber stubs are a portion of optical fiber that includes the core and cladding but not the insulative jacket. Once the fiber stubs are attached to the grooves, the fiber stubs are disposed into the trenches in the semiconductor substrate thereby passively aligning the optical component to the optical device on the substrate.

Passive alignment of optical components using optical fiber stubs

An apparatus for providing single mode optical signal coupling between an opto-electronic transceiver and a single mode optical fiber array takes the form of a lens array and a ferrule component. The lens array includes a plurality of separate lens element disposed to intercept a like plurality of single mode optical output signal from the opto-electronic transceiver and provide as an output a focused version thereof. The ferrule component includes a plurality of single mode fiber stubs that are passively aligned with the lens array and support the transmission of the focused, single mode optical output signals towards the associated single mode optical fiber array.

Single mode fiber array connector for opto-electronic transceivers

Embodiments described herein describe a sub-mount that is etched to include respective cavities with at least two adjacent sides that align optical filters and a mirror. Moreover, the cavities are arranged on the sub-mount such that when the filters and mirror are disposed in the cavities, they align in a manner that enables the performance of a multiplexing or demultiplexing function as part of, for example, a zigzag multiplexer/demultiplexer. In one embodiment, the filters and mirrors are aligned passively rather than actively. The sub-mount may then be placed on a substrate that includes other components of a ROSA or TOSA. In one embodiment, the substrate is also etched to include a cavity two adjacent sides to align the sub-mount so that sub-mount is passively aligned once disposed into the cavity.

Aligning optical components in a multichannel receiver or transmitter platform

An arrangement for providing passive alignment of optical components on a common substrate uses a set of reference cavities, where each optical device is positioned within a separate reference cavity. The reference cavities are formed to have a predetermined depth, with perimeters slightly larger than the footprint of their associated optical components. The reference cavity includes at least one right-angle corner that is used as a registration corner against which a right-angle corner of an associated optical component is positioned. The placement of each optical component in its own reference cavity allows for passive optical alignment to be achieved by placing each component against its predefined registration corner.

Arrangement for placement and alignment of opto-electronic components

A wafer scale implementation of an opto-electronic transceiver assembly process utilizes a silicon wafer as an optical reference plane and platform upon which all necessary optical and electronic components are simultaneously assembled for a plurality of separate transceiver modules. In particular, a silicon wafer is utilized as a 'platform' (interposer) upon which all of the components for a multiple number of transceiver modules are mounted or integrated, with the top surface of the silicon interposer used as a reference plane for defining the optical signal path between separate optical components. Indeed, by using a single silicon wafer as the platform for a large number of separate transceiver modules, one is able to use a wafer scale assembly process, as well as optical alignment and testing of these modules.

Wafer scale packaging platform for transceivers

Growing community of inventors

Orefield, PA, United States of America

Kalpendu Shastri