Electro Scientific Industries, Inc.

Xsil Technology Limited

Kali Dunne

Adrian Boyle

David Gillen

Maria Farsari

Callian Cillian O'Briain Fallon

Cillian O'BRIAIN Fallon

Eva Fernandes Gomez

Richard Toftness

A method of laser machining a feature in a substrate includes machining the substrate with a pulsed laser along a scan line so that the successive pulsesat the substrate do not overlap but are either contiguous or spaced apart. Pulsesin respective succeeding scans of the laser along the scan line, are offset with respect to the starting point of pulsesin a previous scan so that multiple successive laser scans provide machining to a required depth while successively smoothing edges,of the feature with each pass.

Laser machining

A UV laser beam is used to machine semiconductor. The beams intensity (I ) is chosen so that it lies in a range of such values for which there is an increasing (preferably linear) material removal rate for increasing I An elongate formation such as a trough or a slot is machined in n scans laterally offset (O_centre), for each value of z-integer in the z direction.

Control of laser machining

Growing community of inventors

Boyle, Ireland

Kali Dunne