Kabushiki Kaisha Toshiba

Toshiba Electronic Devices & Storage Corporation

Kakeru Yamaguchi

Tetsuya Yamamoto

Jun Karasawa

Katsuya Sato

A semiconductor device of an embodiment includes a first lead frame, a second lead frame located apart from the first lead frame, a semiconductor chip mounted on the first lead frame, and a conductive member. The conductive member electrically connects an electrode of the semiconductor chip to the second lead frame through a conductive adhesive. The conductive member includes a cut face located apart from a bonding face of the electrode, on which the conductive member is bonded.

Semiconductor device comprising first and second lead frames

A method for manufacturing a semiconductor device includes: fixing a semiconductor chip to a first part of a leadframe; bonding one connector member to a first terminal of the semiconductor chip, a second terminal of the semiconductor chip, a second part of the leadframe, and a third part of the leadframe; forming a sealing member; and separating a first conductive part of the connector member and a second conductive part of the connector member by removing at least a section of the portion of the connector member exposed outside the sealing member, the first conductive part being bonded to the first terminal and the second part, the second conductive part being bonded to the second terminal and the third part.

Method for manufacturing semiconductor device including a semiconductor chip and lead frame

A semiconductor device according to one embodiment includes a first leadframe, a second leadframe, a semiconductor chip, and a conductive member. The second leadframe has a first face provided with a recess and is separated from the first leadframe. The semiconductor chip is mounted on the first leadframe. The conductive member has a second face connected to the first face with a conductive adhesive, the second face provided with a protrusion housed in the recess at least partially, and the conductive member electrically connected the semiconductor chip and the second leadframe to each other. The recess and the protrusion are longer in a first direction in which the first face extends than in a second direction along the first face and orthogonal to the first direction.

Growing community of inventors

Yokohama, Japan

Kakeru Yamaguchi