Lintec Corporation

Kaisuke Yanagimoto

Mikihiro Kashio

Kiichiro Kato

Isao Ichikawa

Kazue Uemura

Sou Miyata

Masaaki Furudate

Yuichi Kozone

Provided is a pressure sensitive adhesive sheet including a resin layer that is a multilayer structure containing at least a layer (X&#x3b2;), a layer (Y), and a layer (X&#x3b1;) laminated in this order, a surface (&#x3b1;) of the layer (X&#x3b1;) of the resin layer having pressure sensitive adhesiveness, at least a constitutional component contained in the layer (Y) being different from constitutional components contained in the layer (X&#x3b1;) and the layer (X&#x3b2;), on the prescribed cross section (P) of the pressure sensitive adhesive sheet, in a range of 250 &#x3bc;m in a horizontal direction freely-selected, a difference between a maximum value and a minimum value of the layer (X&#x3b1;) being 3.00 &#x3bc;m or more, and a difference between a maximum value and a minimum value of the layer (Y) being 5.00 &#x3bc;m or more.

Adhesive sheet and method for producing adhesive sheet

An adhesive composition for a semiconductor includes an acrylic polymer (A), an epoxy-based heat curable resin (B), a heat curing agent (C), a silane compound (D) having an organic functional group, molecular weight of 300 or more and an alkoxy equivalent of larger than 13 mmol/g, and a silane compound (E) having an organic functional group, molecular weight of 300 or less and an alkoxy equivalent of 13 mmol/g or less.

Adhesive compositions for a semiconductor, an adhesive sheet for a semiconductor and a production method of a semiconductor device

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Saitama, Japan

Kaisuke Yanagimoto