Micron Technology Incorporated

Kaiming Luo

Indra V Chary

John David Hopkins

Jordan D Greenlee

Rita J Klein

Nancy M Lomeli

Xiao Li

Vinayak Shamanna

Jiewei Chen

Jun Fang

Vladimir Samara

Matthew J King

Harsh Narendrakumar Jain

Kok Siak Tang

Md Zakir Ullah

Sarfraz Qureshi

Jessica Jing Wen Low

Some embodiments include an integrated assembly having a source structure, and having a stack of alternating conductive levels and insulative levels over the source structure. Cell-material-pillars pass through the stack. The cell-material-pillars are arranged within a configuration which includes a first memory-block-region and a second memory-block-region. The cell-material-pillars include channel material which is electrically coupled with the source structure. Memory cells are along the conductive levels and include regions of the cell-material-pillars. A panel is between the first and second memory-block-regions. The panel has a first material configured as a container shape. The container shape defines opposing sides and a bottom of a cavity. The panel has a second material within the cavity. The second material is compositionally different from the first material. Some embodiments include methods of forming integrated assemblies.

Integrated assemblies and methods of forming integrated assemblies

Microelectronic devices include a stack structure with a vertically alternating sequence of insulative structures and conductive structures arranged in tiers. A series of slit structures extends through the stack structure and divides the stack structure into a series of blocks. In a progressed portion of the series of blocks, each block comprises an array of pillars extending through the stack structure of the block. Also, each block&#x2014;in the progressed portion&#x2014;has a different block width than a block width of a neighboring block of the progressed portion of the series of blocks. At least one pillar, of the pillars of the array of pillars in the progressed portion, exhibits bending. Related methods and electronic systems are also disclosed.

Microelectronic devices with tiered blocks separated by progressively spaced slits, and related methods and systems

Growing community of inventors

Singapore, Singapore

Kaiming Luo