Western Digital Technologies, Inc.

Sandisk Technologies Inc.

Kailei Zhang

Junrong Yan

Chee Keong Chin

Min Chao Zhao

Yi Wu

Kim Lee Bock

Zhonghua Qian

Jianming Zhang

Keming Zhou

A method includes the step of thinning a semiconductor wafer by a horizontal stealth lasing process, and semiconductor wafers, dies and devices formed thereby. After formation of an integrated circuit layer on a semiconductor wafer, the wafer may be thinned by supporting an active surface of the wafer on a rotating chuck, and focusing a horizontally-oriented laser in multiple cycles at different radii within the rotating wafer. Upon completion of the multiple cycles, a portion of the wafer substrate may be removed, leaving the wafer thinned to its final thickness. Thereafter, a vertical stealth lasing process may be performed to cut individual semicondcutor dies from the thinned wafer.

Semiconductor wafer thinned by horizontal stealth lasing

A semiconductor device is disclosed including a die stack including a number of dies aligned with each other with respect to an axis, and a top die that is offset along the axis the to prevent die cracking.

Semiconductor device with top die positioned to reduce die cracking

Growing community of inventors

Shanghai, China

Kailei Zhang