Akustica, Inc.

Carnegie Mellon University

Google Inc.

Ninesigma, Inc.

Kaigham Jacob Gabriel

John J Neumann, Jr

Michael James Daley

Brett Mathew Diamond

Xu Zhu

Matthew A Zeleznik

Jason P Goodelle

Wayne A Loeb

Jan E Vandemeer

Philip Sean Stetson

Todd M Przybycien

Evan Indianer

Christopher M Umbel

Steinar Hauan

Michael Bartkovsky

Mehran Mehregany

Joel Lenhart

An electrostatic speaker is described that includes a curved diaphragm positioned between two electrically conductive plates. According to aspects, the curved diaphragm has an 'S-shape' and is configured to electrostatically move between the conductive plates. In particular, the curved diaphragm may generally roll between the two conductive plates so as to move from left to right with respect to ends of the conductive plates and push air in a direction toward ends of the conductive plates, thus generating acoustic output. In some implementations, the configuration of the electrostatic speaker reduces a biasing voltage required for the conductive plates.

Electrostatic speaker

This document describes MEMS-released curved image sensors capable of sensing light from a monocentric lens. This MEMS-released curved image sensor receives light focused on a curved focal surface by releasing a photodetector side of a computing and sensing wafer, such as a Complementary Metal-Oxide Semiconductor (CMOS) sensor. This releasing is effective to allow the photodetector side to conform to the curved focal surface of the monocentric lens. By so doing, the wider field of view, smaller size, and often smaller weight of monocentric lenses can be gained while using generally high-quality, low-cost computing and sensing wafers by processing these wafers to give them a curved surface at which to sense light from a monocentric lens.

MEMS-released curved image sensor

A MEMS device includes a chip carrier having an acoustic port extending from a first surface to a second surface of the chip carrier, a MEMS die disposed on the chip carrier to cover the acoustic port at the first surface of the chip carrier, and an enclosure bonded to the chip carrier and encapsulating the MEMS die.

MEMS device including a chip carrier

Provided is a micro-electromechanical-system (MEMS) device including a substrate; at least one semiconductor layer provided on the substrate; a circuit region including at least one chip containing drive/sense circuitry, the circuit region provided on the at least one semiconductor layer; a support structure attached to the substrate; at least one elastic device attached to the support structure; a proof-mass suspended by the at least one elastic device and free to move in at least one of the x-, y-, and z-directions; at least one top electrode provided on the at least one elastic device; and at least one bottom electrode located beneath the at least one elastic device such that an initial capacitance is generated between the at least one top and bottom electrodes, wherein the drive/sense circuitry, proof-mass, supporting structure, and the at least one top and bottom electrodes are fabricated on the at least one semiconductor layer.

Proof-mass with supporting structure on integrated circuit-MEMS platform and method of fabricating the same

Method of fabricating MEMS device

Proof-mass with supporting structure on integrated circuit-MEMS platform

A micro-electro-mechanical system (MEMS) device is described having a membrane which can be induced to resonate and the frequency of its resonance can be monitored. Chemical moieties can be attached to the membrane, and these moieties can be selected such that they have an affinity for molecules of interest, especially biological molecules of interest. When molecules of interest bind to the moieties they increase the mass of the membrane and thereby change the frequency of the membrane's resonance. By monitoring the resonance one can obtain an indication of the presence of the molecules of interest and in some circumstances an indication of the approximate concentration of these molecules. In addition, several types of moieties having affinities for several different molecules of interest can be placed on the membrane in such a way that the sensor can detect the presence of several different types of molecules of interest and distinguish which ones may be present and which ones may be absent.

MEMS membrane based sensor

An acoustic transducer comprising a substrate; and a diaphragm formed by depositing a micromachined membrane onto the substrate. The diaphragm is formed as a single silicon chip using a CMOS MEMS (microelectromechanical systems) semiconductor fabrication process. The curling of the diaphragm during fabrication is reduced by depositing the micromachined membrane for the diaphragm in a serpentine-spring configuration with alternating longer and shorter arms. As a microspeaker, the acoustic transducer of the present invention converts a digital audio input signal directly into a sound wave, resulting in a very high quality sound reproduction at a lower cost of production in comparison to conventional acoustic transducers. The micromachined diaphragm may also be used in microphone applications.

MEMS digital-to-acoustic transducer with error cancellation

The present invention is directed to a structure comprised of alternating layers of metal and sacrificial material built up using standard CMOS processing techniques, a process for building such a structure, a process for fabricating devices from such a structure, and the devices fabricated from such a structure. In one embodiment, a first metal layer is carried by a substrate. A first sacrificial layer is carried by the first metal layer. A second metal layer is carried by the sacrificial layer. The second metal layer has a portion forming a micro-machined metal mesh. When the portion of the first sacrificial layer in the area of the micro-machined metal mesh is removed, the micro-machined metal mesh is released and suspended above the first metal layer a height determined by the thickness of the first sacrificial layer. The structure may be varied by providing a base layer of sacrificial material between the surface of the substrate and the first metal layer. In that manner, a portion of the first metal layer may form a micro-machined mesh which is released when a portion of the base sacrificial layer in the area of the micro-machined mesh is removed. Additionally, a second layer of sacrificial material and a third metal layer may be provided. A micro-machined mesh may be formed in a portion of the third metal layer. The structure of the present invention may be used to construct variable capacitors, switches and, when certain of the meshes are sealed, microspeakers and microphones.

Multi-metal layer MEMS structure and process for making the same

The present invention provides a process and a system for matching buyers and sellers of goods and/or services for a project. The invention enables a buyer to specify a project in terms of physical, functional, temporal, financial, and/or transactional parameters () which are then automatically converted, by the present invention, into at least one request for goods/services () needed to complete the project. The requests are suitably provided to at least one seller, who may be pre-identified by the buyer as a preferred seller. Upon receiving a request, the seller may submit a response to the request, as desired. Additionally, the invention provides a forum for the negotiation of any agreemments and the formation of contracts to provide the requested, or alternative goods/services (). Further, the present invention provides a system and process for targeting marketing to online buyers based upon profiles established for the buyers, profiles for the sellers, and the current on-line activities of a buyer. The targeted marketing features are preferably provided by utilizing Profile links which provide hyper links to a web page associated with a seller.

Systems and methods for facilitating research and development

Each of a plurality of speaklets (MEMS membranes) produces a stream of clicks (discrete pulses of acoustic energy) that are summed to generate the desired soundwave. The speaklets are selected to be energized based on the value of a digital signal. The greater the significance of the bit of the digital signal, the more speaklets that are energized in response to that bit. Thus, a time-varying sound level is generated by time-varying the number of speaklets emitting clicks. Louder sound is generated by increasing the number of speaklets emitting clicks. The present invention represents a substantial advance over the prior art in that sound is generated directly from a digital signal without the need to convert the digital signal first to an analog signal for driving a diaphragm.

Method and apparatus for reconstruction of soundwaves from digital signals

The present invention describes a processes that builds an acoustic cavity, a chamber, and vent openings for acoustically connecting the chamber with the acoustic cavity. The dry etch processes may include reactive ion etches, which include traditional parallel plate RIE dry etch processes, advanced deep and inductively coupled plasma RIE processes. Three embodiments for connecting the chamber to the cavity from the top side of the substrate, e.g. by using pilot openings formed using at least a portion of the mesh as an etch mask, by forming the vent openings using at least a portion of the mesh as an etch mask, or by having the chamber intersect the vent openings as the chamber is being formed, illustrate how the disclosed process may be modified. By forming the cavity on the back side of the substrate, the depth of the vent holes is decreased. Additionally, using at least a portion of the micro-machined mesh as an etch mask for the vent holes makes the process self-aligning.

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Pittsburgh, PA, United States of America

Kaigham Jacob Gabriel