Sumitomo Seika Chemicals Co., Ltd.

Kaichiro Nakao

Norihiro Sugihara

Eiichi Araki

Hiroshi Manabe

Tooru Takei

The aqueous dispersion of polyamide resin of the present invention comprises dispersed polyamide resin particles, basic material and water. The dispersed polyamide resin particles have a weight-average diameter of 0.1-10 &mgr;m. The ratio of end carboxyl groups to end amino groups in the polyamide resin is between 60/40 and 100/0. The amount of said basic material added is 0.2-3.0 mol per mol of end carboxyl groups. Such an aqueous dispersion of polyamide resin can be manufactured by adding the polyamide resin to an aqueous dispersion medium containing 0.2-3.0 mol of basic material per mol of end carboxyl groups in the polyamide resin.

Aqueous polyamide resin dispersion and process for producing the same

A heat-fusion bonding adhesive is prepared by heating a thermoplastic resin to a temperature of no less than the softening temperature of the resin and then dispersing the resin in the softened state in an aqueous medium. Dispersing the thermoplastic resin in the aqueous medium is conducted, for example, by applying a shear force to the aqueous medium by stirring. In this case, stirring of the aqueous medium is preferably conducted till the thermoplastic resin is divided into particles with a weight-average particle size of 0.1-20 &mgr;m.

Process for producing adhesive for fusion bonding, adhesive for fusion bonding obtained by the process, and adhesive fabric containing the adhesive for fusion bonding

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Hyogo, Japan

Kaichiro Nakao