Ricoh Company, Ltd.

Kaichi Ueno

Takahiko Kuroda

Kouji Ohnishi

Kazunori Ito

Toshiroh Tokuno

Michio Umezawa

Mitsugu Irinoda

Manabu Nishimura

Mamoru Ishida

An actuator element includes an electrode film; and an insulation film layered on the electrode film including a through hole for connecting a wiring which is formed on the insulation film to the electrode film. A shape of a rim of the through hole is either a closed curve free of corners or a polygon with vertex angles which are larger than 90 degrees.

Actuator element, liquid drop discharge head, liquid drop discharge apparatus and image forming apparatus

A recording apparatus includes a liquid droplet discharging head and a tank. The liquid droplet discharging head discharges a liquid droplet. The tank supplies a liquid to the liquid droplet discharging head. The liquid droplet discharging head includes a liquid droplet discharging head circuit board including a board substrate and a writing pattern. The wiring pattern is located on the board substrate to supply power and includes a plurality of divided wiring patterns formed by dividing at least a part of the wiring pattern in a width direction of the wiring pattern.

Recording apparatus, liquid droplet discharging head, and liquid droplet discharging head circuit board with improved wiring pattern

This patent specification describes a droplet-ejecting head including a nozzle substrate having a plurality of nozzles for ejecting droplets, and an actuator configured to be driven to generate energy for ejecting droplets through each nozzle. The nozzle substrate is cleaned by a cleaning liquid containing microbubbles before being bonded to another member.

Method and droplet-ejecting head for droplet-ejecting recording apparatus capable of achieving high recording image quality

A semiconductor device having a multilayer interconnection structure, includes a substrate having a metal interconnect layer provided thereon and N number (N being an integer of 2 or greater) of layers of insulating film formed one on top of another on the substrate. Each layer of insulating film has a metal interconnect layer including at least one bonding pad section provided thereon. At least one via hole filled with an electrically conductive material is provided in each of the layers for interconnecting metal interconnect layers. At least one bonding pad connecting hole filled with an electrically conductive material is provided in each of the layers for interconnecting bonding pad sections. The at least one bonding pad connecting hole is no more than twice as large in diameter as a smallest via hole.

Growing community of inventors

Osaka, Japan

Kaichi Ueno