Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.

Technische Unversität Berlin

Huawei Technologies Duesseldorf Gmbh

Kai Zoschke

Hans-Hermann Oppermann

Charles-Alix Manier

Tolga Tekin

Martin Wilke

Ivan Ndip

Thomas Fritzsch

Klaus-Dieter Lang

Hermann Oppermann

Michael Töpper

Mathias Bottcher

Robert Gernhardt

Markus Wöhrmann

Oswin Ehrmann

Lena Goullon

Frank Windrich

M Jürgen Wolf

Mathias BÖTTCHER

A method for manufacturing a device is provided. The method comprises providing a first carrier having attached thereto a plurality of chips by means of an adhesive layer of the first carrier, a first surface of the plurality of chips being attached to the first carrier. Further, the method comprises selectively attaching a second surface of a subset of the plurality of chips to a conveyor carrier by means of a structured adhesive layer of the conveyor layer. Further, the method comprises selectively releasing the subset of the plurality of chips from the first carrier by means of debonding corresponding sections of the adhesive layer of the first carrier. Further, the method comprises attaching the first surface of the subset of the plurality of chips to a substrate of the device.

Massive parallel assembly method

The invention relates to a carrier arrangement (), and a method for producing a carrier arrangement. The method comprises:

Method for producing a carrier arrangement

Disclosed is a system for and a method of manufacturing of an optical system, including a first optical component, comprising a first waveguide and a carrier substrate, wherein the first optical component is arranged on the carrier substrate. The first optical component comprises a first markup set having a defined position/orientation with respect to the first waveguide, the carrier substrate has a second markup set detectable based on a relative position/orientation of the first and second markup sets when a desired orientation of the first waveguide relative to the carrier substrate is achieved in a reference plane extending parallel to a surface of the carrier substrate.

Markup system for optical system, carrier substrate, and method for manufacturing of same

A module unit includes a carrier substrate and an antenna substrate. The carrier substrate at least includes an embedded chip and a redistribution layer arranged on the first main surface. The antenna substrate including a base material includes an antenna structure arranged on the side of the first main surface, and a cavity introduced on the side of the second main surface, the cavity being aligned with the antenna structure at least in areas. The antenna substrate is connected with the second main surface to the first main surface of the carrier substrate, so that the antenna substrate and the carrier substrate form a layer stack.

Module unit having integrated antennas

A method for manufacturing a semiconductor component including: providing a flat carrier with an upper side and a lower side, the carrier including a continuous opening that runs between the upper side and the lower side; providing a semiconductor arrangement that includes a semiconductor chip that includes electrically and/or optically active regions on a lower side; arranging the semiconductor arrangement in the opening such that a lower side of the semiconductor arrangement and the lower side of the carrier run in a common plane; casting the semiconductor arrangement with a potting compound, such that the semiconductor arrangement is materially connected to the carrier; and thinning out the semiconductor system by way of grinding from above, such that an upper side of the carrier and an upper side of the semiconductor arrangement run in a common plane.

Method for manufacturing a semiconductor component and a semiconductor component

The present invention relates to a bonding method for connecting a first wafer and a second wafer, wherein firstly a first adhesive layer is deposited onto a surface of the first wafer. Furthermore, a second adhesive layer is deposited onto the first adhesive layer, and the two adhesive layers are structured by way of selective removal of both adhesive layers in at least one predefined region of the first wafer, Moreover, the first wafer is connected to the second wafer by way of pressing a surface of the second wafer onto the second adhesive layer, wherein the second adhesive layer is more flowable that the first adhesive layer on connecting the first wafer to the second wafer.

Bonding method for connecting two wafers

A method for manufacturing metal structures for the electrical connection of components comprises the following steps: depositing an auxiliary layer on a substrate; structuring the auxiliary layer in a manner such that the substrate is exposed at least one environment which is envisaged for the metal structures; depositing a galvanic starting layer on the structured auxiliary layer; depositing a lithography layer on the galvanic starting layer and structuring the lithography layer in a manner such that the galvanic starting layer is exposed at least one location envisaged for the metal structure; galvanically depositing the at least one metal structure at the at least one exposed location; removing the structured auxiliary layer. An electronic component is also described.

Method for manufacturing a contact bump by thermal expansion of a patterned sacrificial layer underneath a galvanic layer

A method for arranging electronic components that includes a plurality of electronic components pasted onto a first front face of a carrier having a bonding layer. The front face and/or the electronic components being provided with a plurality of bonding points and the diameter of and distance between the bonding points are selected such that each of the plurality of electronic components is attached by at least three bonding points to the carrier having the bonding layer. The method also includes arranging at least one portion of the plurality of the components on a switching element carrier and connecting the components to the carrier. The method also includes detaching a component from the carrier having a bonding layer, using a solvent or a mechanical force that separates the carrier having a bonding layer and the switching element carrier from one another.

Growing community of inventors

Berlin, Germany

Kai Zoschke