The Hong Kong University of Science and Technology

Kai Zhang

Matthew Ming Fai Yuen

Xinfeng Zhang

Kan Kan Yeung

Zhaoli Gao

Min Zhang

Huansu Xu

A thermal interface material provides thermal conduction or thermal dissipation across an interface, using a three-dimensional interconnected porous graphene (3D-IPG) foam structure. The 3D-IPG foam structure is constructed of three-dimensional interconnected graphene sheets formed as a plurality of monolayers, and having an flexible interconnection architecture. The flexible interconnection architectures allow the 3D-IPG to maintain a high interfacial thermal conductance by the 3D-IPG filling a gap between a heat source and a heat sink across the interface, and by capping small features up to nanoscale roughened surfaces.

Three dimensional interconnected porous graphene-based thermal interface materials

A heat dissipation structure with aligned carbon nanotube arrays formed on both sides. The carbon nanotube arrays in between a heat source and a cooler are used as thermal interface material extending and dissipating heat directly from a heat source surface to a cooler surface. In some embodiments, an adhesive material can be used to dispense around carbon nanotube arrays and assemble the heat dissipation structure in between a heat source and a cooler. In some other embodiments, carbon nanotube arrays are formed on at least one of a heat source surface and a cooler surface and connect them together by further growing. The carbon nanotube arrays can be exposed to the environment instead of being in between a heat source and a solid cooler, and can serve as fins to enlarge heat dissipation area and improve thermal convection.

Heat dissipation structure with aligned carbon nanotube arrays and methods for manufacturing and use

Growing community of inventors

Hong Kong, China

Kai Zhang