Taiwan Semiconductor Manufacturing Comp. Ltd.

Industrial Technology Research Institute

Egalax_empia Technology Inc.

Castles Technology Co., Ltd.

Kai-Yu Cheng

Chih-Han Lin

Horng-Huei Tseng

Che-Cheng Chang

Sin-Yi Yang

Ching-Kun Huang

Hung-Ming Tai

Jung-Tsung Chou

Huang-Chi Huang

Ching-Ming Yeh

Shih-Kang Tien

Chiung-Huei Huang

Yen-Liang Chen

Hung-Chun Lin

Chi-Sheng Chang

Jiong-Shiun Hsu

Hsiang-Han Hsu

Yi-Ching Chen

Yu-Ping Lan

Yu-Shyan Liu

Jeah-Sheng Wu

Yu-Yi Su

A semiconductor device and method of manufacture are provided. In an embodiment a first contact is formed to a source/drain region and a dielectric layer is formed over the first contact. An opening is formed to expose the first contact, and the opening is lined with a dielectric material. A second contact is formed in electrical contact with the first contact through the dielectric material.

Semiconductor device and methods of manufacture

A semiconductor device having a composite barrier structure over a transistor and a method for manufacturing the same is disclosed. The method includes a series of steps including: forming a transistor having source/drain regions within a fin structure and adjacent to a gate structure across over the fin structure; forming first source/drain contacts right above and electrically connected to the source/drain regions; depositing a composite barrier structure over the transistor and the first source/drain contacts; and forming second source/drain contacts right above and electrically connected to the first source/drain contacts. The method further includes depositing a second etch-stop layer before depositing the composite barrier structure and forming second source/drain contacts right above and electrically connected to the first source/drain contacts. The method also includes forming contacts over and electrically connected to the second source/drain contacts.

Semiconductor device and method for manufacturing the same

The present invention provides a touch sensitive processing method for switch an electronic system into a normal operation mode upon receiving a touch gesture in a power saving mode. The electronic system includes a host and a power supply module. The host is configured to execute an operating system to control the electronic system in the normal operation mode. The power supply module is configured to supply power to the host in the normal operation mode and to cut power supply to the host in the power saving mode. The touch sensitive processing method includes: detecting multiple touch events via multiple touch sensitive electrodes of a touch panel; determining whether a power-on command is formed by these touch events; and sending a power-on notification to the power supply module for supplying power to the host and switching to the normal operation mode when the power-on command is formed by these touch events.

Electronic system, touch sensitive processing apparatus and method thereof for switching to normal operation mode upon receiving touch gesture in power saving mode

A semiconductor structure includes a first dielectric layer, a first conductive via, a partial landing pad, a second dielectric layer, and a second conductive via. The first conductive via is disposed in the first dielectric layer. The partial landing pad is disposed on the first conductive via and the first dielectric layer, in which the partial landing pad has a top surface and a bottom surface, and the top surface of the partial landing pad has a width greater than or substantially equal to that of the bottom surface of the partial landing pad. The second dielectric layer is disposed on the partial landing pad. The second conductive via is disposed in the second dielectric layer and electrically connected to the partial landing pad.

Semiconductor structure and manufacturing method thereof

The present invention is a safety covering design for financial transaction device, simply constructing specific solid connection between boards by the pressure formed after assembly. The pressure is formed with assembly and constructing connection of units, so illegally penetration can be easily detected, because the pressure is released by disassembly as well as the connection between boards is removed. Thus, the financial transaction device of the present invention is not easy being penetrated without alarm.

Safety cover design for financial transaction device

A nano-indentation ultrasonic detecting system for detecting mechanical properties of a target material. An indentation device, disposed on a surface of the target material, generates an indentation on the surface, obtaining the relation between the Young's modulus and the Poisson's ratio of the target material. An ultrasonic generator is movably disposed on the surface of the target material, generating at least two different ultrasonic signals thereon. An ultrasonic receiver is disposed on the surface of the target material and separated from the ultrasonic generator, receiving the ultrasonic signals. The result of a nano-indentation experiment are applied in the ultrasonic theory and iterated by the ultrasonic experimental data and theory, obtaining the Young's modulus of the target material. The obtained Young's modulus of the target material is substituted back in the result of the nano-indentation experiment, obtaining the Poisson's ratio of the target material.

Nano-identation ultrasonic detecting system and method thereof

A fiber optic interferometric position sensor and measurement method thereof suitable for determining the moving direction of a measurement object in an environment of high electric or magnetic field strengths are disclosed. The fiber optic interferometric position sensor comprises at least one light source, a plurality of fiber optic couplers, a plurality of sensing fibers and a plurality of photodetectors. The fiber optic couplers are connected to the at least one light source, the photodetectors, and the sensing fibers, respectively. The measurement method comprises: providing a fiber optic interferometric position sensor and a measurement object, obtaining two initial signals having a 90-degree phase difference therebetween, obtaining two measured signals, correcting the measured signals by a bias correction method, obtaining the phase value from the two measured signals by an electronic interpolation technique, and obtaining the position of the measurement object after computation by using the phase value.

Fiber optic interferometric position sensor and measurement method thereof

A system and a method for thickness measurement that comprises providing a first confocal microscope, emitting a first light beam from the first confocal microscope in a first direction, focusing the first beam at a first focal plane, providing a second confocal microscope, emitting a second light beam from the second confocal microscope in a second direction substantially opposed to the first direction, focusing the second beam at a second focal plane, and adjusting the relative position of the first and second microscopes by overlapping the first and second focal planes.

System and method for thickness measurement

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Taipei, Taiwan

Kai-Yu Cheng