Hon Hai Precision Industry Co., Ltd.

Kai-Wen Wu

Tai-Cherng Yu

Yi-Zhong Sheu

A device projecting images by micro electro-mechanical system (MEMS) technology mirrors includes a base, a first substrate, a first reflective mirror, a second substrate, and a second reflective mirror. The first substrate and the second substrate are adjacently positioned on the base. The first reflective mirror is formed on the first substrate by a micro electro-mechanical system (MEMS) technology and configured for receiving a light beam and rotating in two directions under control of the MEMS for reflect the received light in two directions. The second reflective mirror is formed on the rotatable second substrate to receive the image and be rotated, thus further adjusting the range of the projected images.

MEMS-based rapidscan device and projector having same

A device projecting images by micro electro-mechanical system (MEMS) technology mirrors includes a base, a rotating seat, a substrate, a reflective mirror, a driver, and a controller. The rotating seat is rotably positioned on the base. The substrate is positioned on the rotating seat. The at least one MEMS reflective mirror is formed on the substrate and configured for rotating in two directions under control of the attached driver and controller to form two-dimensional images in a range.

An optical PCB includes a substrate, conductive traces, a solder resist layer, and a light waveguide. The substrate includes a surface. The surface includes a flat area. The conductive traces are formed on the surface of the substrate and only positioned outside of the flat area. The solder resist layer is formed on the substrate and covers the conductive traces. The light waveguide is positioned on the solder resist layer. An orthogonal projection of the light waveguide on the surface of the substrate coincides with the flat area.

Optical printed circuit board

A photoelectric coupling module includes a substrate, a photoelectric unit, and a lens module. The substrate carries at least two alignment marks for correct and absolute positioning of the lens module on the substrate. The photoelectric unit is positioned on the substrate. The lens module defines at least two through holes aligned with the alignment marks.

Photoelectric coupling module

A photoelectric coupling module includes a substrate, a photoelectric unit, and a lens module. The substrate defines a positioning recess. The photoelectric unit is positioned on the substrate. The lens module includes a reflection surface, a plurality of first lenses, and a plurality of second lens. Optical axes of the first lenses cross optical axes of the second lenses on the reflection surface. The lens module further includes a positioning portion extending downward from a bottom surface, and the positioning portion is received in the positioning recess. The first lenses are aligned with the photoelectric unit.

Photoelectric coupling module capable of packaging firmly

A miniature projection device includes a rotatable bracket assembly, a rotating plate, a driving device, and a light source unit. The rotating plate is rotatably mounted to the rotatable bracket assembly. The driving device is configured to drive the rotatable bracket assembly to rotate in a first direction, and to drive the rotatable plate to rotate in a second direction. The first direction is substantially perpendicular to the second direction. The light source unit is mounted on the rotatable plate and is capable of rotating together with the rotating plate. The light source unit is configured to emit laser beams and to project the laser beams onto a screen.

Miniature projection device for emitting laser beams

A circuit board comprises a signal routing layer, a first dielectric layer, a second dielectric layer, a third dielectric layer, a first ground layer, a second ground layer, and a third ground layer. The signal routing layer includes chip traces, connector traces, and signal traces connected to components. The first dielectric layer, the first ground layer, the second dielectric layer, the second ground layer, the third dielectric layer, and the third ground layer, in that order, are located at gradually increasing distances from the signal routing layer. The first ground layer corresponds to the chip traces, the second ground layer corresponds to the signal traces, and the third ground layer corresponds to the connector traces.

Circuit board with signal routing layer having uniform impedance

An exemplary laser projection device includes a substrate, three laser chips mounted on the substrate, and a spectroscope arranged on laser beams paths of the laser chips. Each laser chip is a laser diode. The spectroscope includes a first group of splitters, and a second group of splitters spaced from the first group of splitters. Laser beams emitted from the laser chips are adjusted into the second group of splitters by the first group of splitters. And then, the laser beams adjusted into the second group of splitters are adjusted to be oriented toward the same direction and mixed together to obtain light of a predetermined color.

Laser projection device with splitters spaced from each other

Optical connector includes a circuit board, a photoelectric element, a driver chip, a coupler, and a holder holding an optical fiber. The circuit board includes a substrate having a first surface and an opposing second surface and a circuit portion formed on the substrate. The substrate defines a receiving groove in the second surface and a through hole passing through a bottom surface of the receiving groove and the first surface. The photoelectric element and the driver chip are positioned on the bottom surface, and the photoelectric element aligns with the through hole. The coupler is positioned on the first surface and aligns with the photoelectric element through the through hole. The holder is supported on the first surface and connected to the coupler. The coupler optically couples the optical fiber with the photoelectric element.

Optical connector

An optical connector package includes a substrate and a casing positioned on the substrate and comprising a positioning pin. The casing and the substrate cooperatively define a receiving space. The positioning pin defines a vent functioning as a sole channel communicating the receiving space with the outside of the casing. The vent is sealed after the optical connector package subjects to all required heating processes.

Optical connector package and optical connector

A circuit board includes a mounting surface and a number of connecting pads on the mounting surface. Each of the connecting pads defines a mounting area for mounting an element thereon. At least two of the connecting pads are substantially circular-shaped.

Circuit board and optical-electrical module with same

An optical fiber coupler includes a male port and a female port. The male port includes a main body, the male transmission lens and the male receiving lens positioned on the main body, and a male optical wave guide assembly. The male base board includes at least one male optical wave guide. Each male optical wave guide includes a male first alignment portion and a male second alignment portion. The male first alignment portion is optically coupled with one male receiving lens; and a male second alignment portion has a greater width than that of the male first alignment portion. The structure of the female port is similar to the male port.

Optical fiber coupler having male port and female port

An optical connector includes a printed circuit board, a photoelectric element, a lens element, and an adhesive. The photoelectric element is positioned on and electrically connected to the printed circuit board. The positioning element is an enclosing wall extending from the printed circuit board and enclosing the photoelectric element. The lens element includes a bottom surface, an internal lens formed on the bottom surface, and a supporting leg, which is an enclosing wall extending from a periphery of the bottom surface. The supporting leg is positioned on the printed circuit board and fittingly engaged with the positioning element. The adhesive is applied between the supporting leg and the printed circuit board.

Optical connector with printed circuit board and lens element bonded to each other

An optical coupler includes a male port and a female port. The male port includes a first main body, a first optical fiber, and a male port lens unit. The male port lens unit includes a first base body, a first male port lens coupling with the first optical fiber, and a second male port lens. The first base body includes a male port reflecting sidewall. The female port includes a second main body, a second optical fiber, and a female port lens unit. The female port lens unit includes a second base body, a first female port lens coupling with the second optical fiber, and a second female port lens coupling with the second male port lens. The second base body includes a female port reflecting surface parallel with the male port reflecting sidewall.

Optical coupler

An optical fiber connector includes a body, a photoelectric conversion module received in the body, a receiving member, and two L-shaped optical fibers. The photoelectric conversion module includes a base, a light emitting unit, and a light receiving unit. The light emitting unit and the light receiving unit are mounted on the base. The receiving member is disposed over the light emitting unit and the light receiving unit and defines two L-shaped receiving holes. The optical fibers are received in the respective receiving holes. One end of one of the two optical fibers is optically aligned and coupled with the light emitting unit. One end of the other optical fiber is optically aligned and coupled with the light receiving unit.

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Taipei, Taiwan

Kai-Wen Wu