Applied Optoelectronics, Inc.

Kai-Sheng Lin

Ziliang Cai

Hao-Chiang Cheng

Kevin Liu

I-Lung Ho

Chong Wang

Hsiu-Che Wang

Justin Lii

Yi Wang

YongXuan Liang

Limin Chen

Chian-Hung Chen

Hang Xie

John Cheng

Jun Zheng

Hao-Hsiang Liao

Qin Li

Hung-Lun Chang

Luohan Peng

Chung-Yung Wang

Stella Liang Chen

Elsie Marentes

Ming Qi

Yong-Xuan Liang

The present disclosure is generally directed to techniques for thermal management within optical subassembly modules that include thermally coupling heat-generating components, such as laser assemblies, to a temperature control device, such as a thermoelectric cooler, without the necessity of disposing the heat-generating components within a hermetically-sealed housing. Accordingly, this arrangement provides a thermal communication path that extends from the heat-generating components, through the temperature control device, and ultimately to a heatsink component, such as a sidewall of a transceiver housing, without the thermal communication path extending through a hermetically-sealed housing/cavity.

Techniques for thermal management within optical subassembly modules

The present disclosure is generally directed to an optical transceiver housing for use in an optical transceiver module with at least one vapor chamber integrated into the transceiver housing. In more detail, the transceiver housing includes at least first and second housing portions on opposite sides and forming a compartment defined by one or more inner surfaces therein. The vapor chamber includes a heat input side and a heat output side on opposite sides of the vapor chamber. An outer wall of at least one of the housing portions may be defined at least in part by the heat output side of the vapor chamber such that the heat output side is exposed to outside of the transceiver housing for transferring heat from inside to outside the optical transceiver module.

Optical transceiver housing with integrated vapor chamber and an optical transceiver module implementing same

An optical fiber holder is disclosed herein that includes at least one confinement slot for routing intermediate optical fibers within a housing of an optical assembly module, and preferably, a plurality of confinement slots for maintaining a target/nominal fiber bending radius for one or more intermediate optical fibers within the housing. Preferably, the optical fiber holder is disposed within the housing of an optical subassembly between an optical component, e.g., a TOSA arrangement and/or ROSA arrangement, and optical coupling receptacles, e.g., LC coupling receptacles, for optically coupling with external fibers for sending and/or receiving optical signals.

Fiber holder for use with optical subassembly modules

Techniques for thermal management within optical subassembly modules and a heater device for laser diode temperature control

A parabolic reflector device (also referred to herein as a parabolic lens device) is disclosed which includes a plurality of parabolic lens members and a mirror member which couple together and collectively provide a light-transmissive structure for multiplexing or demultiplexing of an optical signal. The parabolic reflector device can be implemented within optical subassembly modules to support operations of transmitter optical subassemblies (TOSAs) and/or receiver optical subassemblies (ROSAs).

Parabolic lens device for use in optical subassembly modules

The present disclosure is generally directed to a component bridge that couples to a feedthrough device to provide additional component mounting surface area within a TOSA housing, and preferably, within a hermetically-sealed TOSA housing. The component bridge includes a body that defines a component mounting surface to couple to electrical components, e.g., one or more filtering capacitors, and a notched portion to provide an accommodation groove. The component bridge includes at least one projection/leg for coupling to a mounting surface of a feedthrough device. The accommodation groove of the component bridge allows for other electrical components, e.g., RF traces, to be patterned/disposed on to the mounting surface and extend at least partially through the accommodation groove while remaining electrically isolated from the same. Accordingly, the component bridge further increases available component mounting surface area for existing feedthrough devices without necessity of re-design and/or modification.

Component bridge for increasing mounting surface area on feedthrough device and an optical subassembly implementing same

In general, the present disclosure is directed to locking arrangements for use with optical subassembly housings, such as small form-factor pluggable (SFFP) housings, that include a handle member configured to rotate about the housing to allow a user to select a target/desired orientation. Preferably, the locking arrangement couples to a pluggable housing that is configured to removably couple into a receptacle of an optical transceiver cage or other suitable enclosure. The locking arrangement further includes a handle member rotatably coupled to the pluggable housing, the handle member being configured to allow the pluggable housing to releasably lock within the receptacle. The handle member is also preferably configured to maintain a user-selected orientation such that the handle member remains at a given angle relative to the pluggable housing in the absence of a user-supplied force.

Locking arrangements for pluggable optical subassembly modules

The present disclosure is generally directed to an optical demultiplexer for use in an optical transceiver module having a truncated profile/shape to increase tolerance and accommodate adjacent optical components. In more detail, the optical demultiplexer comprises a body with at least one truncated corner at the input end. The at least one truncated corner allows the optical demultiplexer to be disposed/mounted, e.g., directly, on a densely populated transceiver substrate, e.g., a printed circuit board (PBC), and provide additional tolerance/space for mounting of circuitry and/or components within the region that would normally be occupied by corner(s) of the optical demultiplexer body. The at least one truncated corner may be introduced in a post-production step, e.g., via cut & polishing, or introduced during formation of the optical demultiplexer using, for instance, photolithography techniques.

Optical demultiplexer with truncated profile and an optical transceiver module implementing same

In general, a temperature control device for use in laser assemblies and optical subassemblies is disclosed that includes at least two electrically conductive terminals to enable flexible electrical coupling to associated components, e.g., monitor photodiodes and laser diodes, and accommodate a range of laser assembly configurations without the necessity of supplying a negative voltage rail. In more detail, a temperature control device consistent with the present disclosure includes a bottom plate, a top plate, and a plurality of semiconductor elements disposed therebetween. The top plate includes a component mounting surface that provides at least a first and second electrically conductive terminal/pad. The first and second electrically conductive terminals/pads can be electrically isolated, e.g., via a gap, and configured to provide first and second voltage potentials respectively.

Temperature control device with a plurality of electrically conductive terminals, and an optical subassembly module implementing same

The present disclosure is generally directed to a stepped profile for substrates that support 'on board' optical subassembly arrangements. The stepped profile enables mounting TOSA modules to the substrate in a recessed orientation to reduce the overall distance between terminals of the substrate and associated components of the TOSA, e.g., RF terminals of the substrate and an LDD of the TOSA. In an embodiment, the stepped profile further simplifies mounting and optical alignment of TOSA modules by providing at least one mechanical stop to engage surfaces of the TOSA modules and limit travel by the same along one or more axis.

Substrate with stepped profile for mounting transmitter optical subassemblies and an optical transmitter or transceiver implementing same

A temperature controlled multi-channel transmitter optical subassembly (TOSA), consistent with embodiments described herein, may be used in a multi-channel optical transceiver. The temperature controlled multi-channel TOSA generally includes an array of lasers to emit a plurality of different channel wavelengths. The lasers may be thermally tuned to the channel wavelengths by establishing a global temperature for the array of lasers such that the amount of heat communicated to each laser is substantially the same. The global temperature may be established, at least in part, by monitoring the shortest channel wavelength and/or a temperature of the lasers. The temperature of the lasers may then get increased via a shared heating device in thermal communication with the lasers until the shortest monitored wavelength substantially reaches the nominal shortest wavelength or the measured temperature substantially equals the global temperature.

Temperature controlled multi-channel transmitter optical subassembly and transceiver module including same

The present disclosure is generally directed to a housing for use with optical transceivers or transmitters that includes integrated heatsinks with a graphene coating to increase thermal dissipation during operation. In more detail, an embodiment of the present disclosures includes a housing that defines at least first and second sidewalls and a cavity disposed therebetween. The first and/or second sidewalls can include integrated heatsinks to dissipate heat generated by optical components, e.g., laser diodes, laser diode drivers, within the cavity of the housing. The integrated heatsinks can include at least one layer of graphene disposed thereon to increase thermal performance, and in particular, to decrease thermal resistance of the heatsink and promote heat dissipation.

Heatsink with graphene coating and an optical transmitter or transceiver implementing same

The present disclosure is generally directed to a monitor photodiode (MPD) submount for use in optical transceivers that includes a body with a conductive trace pattern disposed on multiple surfaces of the same to allow for vertical mounting of an associated MPD and simplified electrical interconnection with TOSA circuitry without the necessity of electrical interconnection. The MPD submount includes a body defined by a plurality of sidewalls. At least one surface of the body provides a mounting surface for coupling to and supporting an MPD. The MPD submount further includes a conductive trace pattern that provides at least one conductive path that is disposed on the mounting surface and on at least one adjoining sidewall. The portion of the at least one conductive path disposed on the adjoining sidewall extends substantially transverse relative to the surface defining the transceiver/transmitter substrate when the MPD submount is coupled to the same.

Monitor photodiode (MPD) submount for vertical mounting and alignment of monitoring photodiodes

In general, a TOSA consistent with the present disclosure includes a light driving circuit coupled to a hermetically-sealed light engine. The hermetically-sealed light engine includes a housing defined by a plurality of sidewalls. The housing defines a cavity that is hermetically-sealed to prevent introduction of contaminants that would otherwise reduce optical power. The hermetically-sealed light engine optically couples to an external arrayed waveguide grating (AWG), or other multiplexing device, by way of an optical receptacle. The optical receptacle can include a waveguide implemented external to the hermetically-sealed cavity and can include, for instance, an optical isolator, fiber stub, and fiber ferrule section. Thus, the external AWG and associated external optical coupling components advantageously allow for the hermetically-sealed light engine to have a cavity with dimensions relatively smaller than other approaches that dispose an AWG and associated components within a hermetically-sealed cavity.

Transmitter optical subassembly with hermetically-sealed light engine and external arrayed waveguide grating

The present disclosure is generally directed to a holder element, also generally referred to herein as a welding element, configured to couple an optical coupling receptacle to a substrate and provide an integrated optical arrangement to redirect light received from the optical coupling receptacle along a receive light path to an output light path that is offset from the receive light path.

Growing community of inventors

Sugar Land, TX, United States of America

Kai-Sheng Lin