Atomic Energy Council-institute of Nuclear Energy Research

Kai-Sheng Chang

Chih-Hung Wu

Kuan-Yu Chu

Hung-Sheng Chiu

Yen-Chang Tzeng

Chieh Cheng

Hwa-Yuh Shih

A wafer stacked on a mounting layer is safely diced. The mounting layer has holes partially corresponding to chips on the wafer. Thus, chips obtained after dicing the wafer can be safely removed from the mounting tape. An amount of the mounting tape used can be reduced. And a production cost can be lowered as well.

Wafer dicing method

A wafer clamp according to the present invention always firmly clamps a wafer. A supporting arm of the wafer clamp will be replaced with a different one according to the wafer size. Moreover, with a larger area of the supporting arm, a wear resistance and a smoothness of the wafer is improved. Besides, the wafer clamp stops the wafer from slipping. Hence, the present invention has a simple structure, a good practicality and a wide application.

Wafer clamp having changeable supporting part

A structure of an optical switch makes the optical switch capable of receiving broadband signals. And the manufacturing procedure is simplified.

Growing community of inventors

Taoyuan County, Taiwan

Kai-Sheng Chang