Hewlett-packard Development Company, L.P.

Applied Materials, Inc.

Kai Ng

Guillermo Andres

Shashank Sharma

Siddarth A Krishnan

Thomas S Neal

Deepak Kamalanathan

John Norman

Nicolas Louis Gabriel Breil

Ria Someshwar

Guillermo Andreas

Exemplary methods of forming a memory structure may include forming a layer of a transition-metal-and-oxygen-containing material overlying a substrate. The substrate may include a first electrode material. The methods may include annealing the transition-metal-and-oxygen-containing material at a temperature greater than or about 500&#xb0; C. The annealing may occur for a time period less than or about one second. The methods may also include, subsequent the annealing, forming a layer of a second electrode material over the transition-metal-and-oxygen-containing material.

Annealing processes for memory devices

A front panel that can be removed from and installed onto a computer hardware chassis. A computer system housing includes a chassis and a removable front panel that is removably connectable to the chassis. The chassis includes a first locking mechanism, a first structure for engaging and releasing the first locking mechanism, a second locking mechanism and a second structure for engaging and releasing the second locking mechanism. The front panel includes a first mating portion for receipt at the first locking mechanism, wherein the first mating portion is removably engaged with the first locking mechanism, and a second mating portion for receipt at the second locking mechanism, wherein the second mating portion is removably engaged with the second locking mechanism.

Removable front panel for a computer hardware chassis

An apparatus and method for flexibly mounting variously sized devices in a computer chassis. A front panel includes a first portion that is reserved for a plurality of contiguous openings supporting a plurality of vertically stacked 3-&#xbd; inch bays. At least one opening is protected by a corresponding knock-out plate. The front panel also includes a second portion that is adjacent to the first portion. The second portion is reserved for a plurality of module acceptors. At least one module acceptor is located adjacent to a corresponding opening and adapted to receive a corresponding module. Additionally, at least one module acceptor includes a first attaching mechanism capable of mating with a second attaching mechanism located on the corresponding module for attaching the corresponding module to the computer chassis. Further, at least one pair of adjacent opening and module acceptor in combination is adapted to receive a front connector panel bracket.

Apparatus and method for flexibly mounting variously sized devices in a computer chassis

A computer housing, removable light pipe device, and method for assembling a computer are disclosed. The computer housing has a drive door assembly and a light pipe. The light pipe is removably coupleable with the drive door assembly.

Computer housing with removable light pipe

Growing community of inventors

San Jose, CA, United States of America

Kai Ng