Qualcomm Incorporated

Sony Corporation

The Johns Hopkins University

Sony Electronics Inc

Kai Liu

Xia Li

Bin Yang

Ludovic Etienne Douillet

Nobukazu Sugiyama

Lobrenzo Wingo

Jonghae Kim

Changhan Hobie Yun

Mario Francisco Velez

Peter C Searson

Andy Nguyen

Chia-Ling Chien

Rui Tang

Ling Jun Wong

Thomas Patrick Dawson

Aixin Liu

Aran London Sadja

Xiaoju Yu

Jeffrey Tang

Srivastava Nanduri

Gang Lin

William Collins

Fengyuan Yang

Examples herein include thermally conductive pathways for glass substrates such as used by passive on glass devices that may be used to enhance the thermal conductivity of an integrated POG device. By using a thermally conductive material for passivation of the device pathways during manufacturing, the device pathways may be able to conduct heat away from the device. For example, by using a selected poly (p-phenylene benzobisoxazole) (PBO) based material (e.g., poly-p-phenylene-2, 6-benzobisoxazole) instead of conventional polyimide (PI) materials during a Cu pattern passivation process, the overall thermal performance of the device, may be enhanced.

Thermal paths for glass substrates

Aspects of the disclosure are directed to a bandpass filter including a first, second, third and fourth resonators, wherein the second and third resonators are in parallel, wherein the first resonator includes a first and second terminals, wherein the second resonator includes a second resonator top terminal and a second resonator bottom terminal, wherein the third resonator includes a third resonator top terminal and a third resonator bottom terminal, wherein the fourth resonator includes a third terminal and a fourth terminal; wherein the first terminal is coupled to the second resonator top terminal, wherein the second terminal is coupled to the third resonator top terminal, wherein the third terminal is coupled to the third resonator bottom terminal, wherein the fourth terminal is coupled to the second resonator bottom terminal; a first inductor coupled to the first and third terminals; and a second inductor coupled to the second and fourth terminals.

Wideband filter with resonators and inductors

Certain aspects of the present disclosure provide apparatus for thermal matching of integrated circuits (ICs). One example apparatus generally includes a first substrate, a first IC disposed on the first substrate and having a second substrate, and a second IC disposed on the first substrate. The second IC may include a third substrate, a thermal conductivity adjustment region comprising different material than the third substrate, the thermal conductivity adjustment region being adjacent to a first side of the third substrate, and one or more electrical components formed in one or more layers of the second IC adjacent to a second side of the third substrate, wherein the first side and the second side are opposite sides of the third substrate, and wherein a thermal conductivity of the thermal conductivity adjustment region is closer to a thermal conductivity of the second substrate than a thermal conductivity of the third substrate.

Techniques for thermal matching of integrated circuits

A power supply package is disclosed, including a power management integrated circuit (PMIC) die with a plurality of switching circuits, and a plurality of integrated 3-dimensional (3D) inductors disposed around the PMIC die. Each 3D inductor corresponds to a switching circuit and is electrically coupled to first and second connections for the corresponding switching circuit. An integrated electromagnetic interference (EMI) shield is disposed between the PMIC and the 3D inductors.

Integrated inductors for power management circuits

A wideband filter includes a passive substrate and an acoustic resonator chip on the passive substrate. The wideband filter further includes a pair of 3D inductors and a 3D transformer on the passive substrate. The pair of 3D inductors and the 3D transformer are connected to the acoustic resonator chip.

Wideband filter including an acoustic resonator chip integrated with 3D inductors and a 3D transformer

Certain aspects of the present disclosure provide a variable transistor-based capacitive element implemented on a glass or dielectric substrate. Such a variable transistor-based capacitive element may be suitable for use as a tunable capacitor in a passive-on-glass (POG) device, for example. One example device having a tunable capacitance generally includes a glass or dielectric substrate and a transistor disposed above the glass or dielectric substrate. The transistor has a gate region, a drain region, and a source region, wherein a capacitance of the transistor is configured to vary based on a voltage between the gate region and the drain region.

Thin-film variable metal-oxide-semiconductor (MOS) capacitor for passive-on-glass (POG) tunable capacitor

Aspects generally relate to an integrated circuit including a glass substrate. On a surface of the glass substrate a thermally conductive insulating layer is formed. At least one metal layer is formed above the thermally conductive insulating layer, and a plurality of thermal bumps extend through the at least one metal layer and couple to the thermally conductive insulating layer to dissipate heat from the substrate.

Thermally enhanced substrate

A passive structure using conductive pillar technology instead of through via technology includes a substrate having a first redistribution layer (RDL) and a three-dimensional (3D) integrated passive device on the substrate. The passive structure includes multiple pillars on the substrate where each of the pillars is taller than the 3D integrated passive device. The passive structure further includes a molding compound on the substrate surrounding the 3D integrated passive device and the pillars. Furthermore, the passive structure includes multiple external interconnects coupled to the first RDL through the pillars.

Three-dimensional high quality passive structure with conductive pillar technology

According to one embodiment of the invention, a method for secured execution of commands is described. Initially, a second electronic device authenticates a first electronic device and registers the first electronic device as a trusted device. Thereafter, up receipt of a message with one or more embedded commands, such commands are executed without any pre-established communication protocol if the message is from the registered first electronic device.

System and method for performing commands from a remote source

A wireless communication device is configured to communicate with at least one other electronic user communication device that is connected to communicate on an electronic communication network. The user's device automatically creates a communication list comprising the at least one other electronic user communication device on the network, and the user communication device sends the communication list to a remote server device. So configured, the user communication device can automatically create a communication list of devices with which the user can use instant messaging or chat-like communications, without having to separately discover, search, or otherwise locate such devices and add them as friends or buddies or approved communication devices to a communication list. Accordingly, the electronic user communication device will provide to a user a communication list without additional registration or other set-up procedures.

Enabling wireless device communication

A method and device is provided for platform independent device communication by detecting a request at a processor-based device to perform a function, determining an external device corresponding to the request, retrieving a tag for the external device for performing a function corresponding to the request and generating a message implemented in XMPP, having embedded therein the tag, wherein the tag is essential at the external device for performing the function corresponding to the request. Receiving the message at a device, determining whether the message comprises a device message, retrieving a tag included in the message, wherein the tag corresponds to an executable command to perform a function and executing the tag to perform the function.

Method and apparatus for enabling device communication and control using XMPP

Rather than have a unique code set per TV product, a common code base is provided to service multiple products and even multiple product lines. Embedded systems can be upgraded through a network connection. The software architecture provides a flexible approach to supporting multiple product offerings through a plug-in modular middle-ware and to providing standardized hardware acceleration for both 2D and 3D graphics. The plug-in capability provides for feature additions and upgrades after sale.

Modular flexible software architecture for TV

The invention is directed to the use of electrochemical deposition to fabricate thin films of a material (e.g., bismuth) exhibiting a superior magnetoresistive effect. The process in accordance with a preferred embodiment produces a thin film of bismuth with reduced polycrystallinization and allows for the production of single crystalline thin films. Fabrication of a bismuth thin film in accordance with a preferred embodiment of the invention includes deposition of a bismuth layer onto a substrate using electrochemical deposition under relatively constant current density. Preferably, the resulting product is subsequently exposed to an annealing stage for the formation of a single crystal bismuth thin film. The inclusion of these two stages in the process produces a thin film exhibiting superior MR with a simple field dependence in the process suitable for a variety of field sensing applications.

Bismuth thin films structure and method of construction

Novel arrays of nanowires made of semi-metallic Bismuth (Bi) is disclosed made by unique electrodeposition techniques. Because of the unusual electronic properties of the semi-metallic Bi and the nanowire geometry, strong finite size effects in transport properties are achieved. In addition, very large positive magnetoresistance, 300% at low temperatures and 70% at room temperature, with quasilinear field dependence have been attained.

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San Diego, CA, United States of America

Kai Liu