Lattice Semiconductor Corporation

Shanghai Biren Technology Co., Ltd

Kai Lei

Kai Zhou

Qiming Wu

Kexin Luo

Min-Kyu Kim

Gijung Ahn

Fei Song

Zhi Wu

Yu Shen

Shinje Tahk

Linglan Zhang

Xiaofeng Wang

YiKai Liang

Yibin Fu

Huan Liu

Jinfu Ye

Yudan Deng

Qi Zhou

Yi Gao

Jiandong Ke

Shirley Li

Oliver Wu

A chip and a chip test method are provided. The chip includes a receiver circuit and a test circuit. The receiver circuit includes a signal receiving unit and a signal bump. The signal bump is coupled to the signal receiving unit. The test circuit is coupled to a circuit node between the signal receiving unit and the signal bump. The test circuit includes a digital-to-analog converter, a first resistor, and a unit gain buffer. A first terminal of the first resistor is coupled to the circuit node. An output terminal of the unit gain buffer is coupled to a second terminal of the first resistor. A first input terminal of the unit gain buffer is coupled to an output terminal of the digital-to-analog converter. A second input terminal of the unit gain buffer is coupled to an output terminal of the unit gain buffer.

Chip and chip test method

A chip and a chip testing method are provided. The chip includes a sending terminal circuit and a test circuit. The sending terminal circuit includes a signal sending unit and a first signal bump. The first signal bump is coupled to the signal sending unit. The test circuit is coupled to a circuit node between the signal sending unit and the first signal bump. The test circuit includes a first resistor, a unit gain buffer, and an analog-to-digital converter. A first terminal of the first resistor is coupled to the circuit node. A first input terminal of the unit gain buffer is coupled to a second terminal of the first resistor. A second input terminal of the unit gain buffer is coupled to an output terminal of the unit gain buffer. An input terminal of the analog-to-digital converter is coupled to the output terminal of the unit gain buffer.

Chip and chip testing method

Some aspects of the present disclosure relate to an apparatus, a PLL and an electronic device. The apparatus comprises a voltage-to-current (V2I) converter, a current controlled oscillator and a compensation current. The V2I converter is operable to receive a first voltage and generate a first current based on the first voltage. The current controlled oscillator is coupled to the V2I converter and operable to generate an oscillation signal based on a second current from or to the V2I converter. The compensation circuit is coupled to the V2I converter and operable to receive a third current from or to the V2I converter. The second and third currents vary in response to at least one of temperature variation and supply voltage variation of the apparatus. Variation direction of the third current is opposite to variation direction of the second current and different frequencies may be provided for a low supply voltage domain.

Auto-compensation for control voltage range of VCO at low power supply

A voltage controlled oscillator (VCO) is disclosed. The VCO includes an amplifier that receives a control signal and a feedback signal and generates an amplified output signal based on the difference between the control signal and the feedback signal. The VCO also includes circuitry to generate an oscillating output signal based on the amplifier output signal. Additionally, the VCO includes a feedback amplifier that generates the feedback signal based on the output of the amplifier. The feedback amplifier includes a first resistor connected in parallel with a second resistor, the second resistor having an adjustable resistance.

Spectrum shaping voltage to current converter

Systems, devices and methods for analog echo cancellation for high speed full duplex data transmissions, which include a first set of differential nodes to receive reception data and transmission data, a second set of differential nodes to receive the transmission data, and a subtraction circuit to receive data from the first set of differential nodes and data from the second set of differential nodes. The subtraction circuit includes a plurality of capacitors to receive data from each of the first and second sets differential nodes, and a termination circuit for providing DC termination voltage to subtract the data of the second set of differential nodes from the data of the first set of differential nodes to eliminate echo from the reception data received at the first set differential nodes.

Echo cancellation for high speed full duplex data transmissions

A method that calibrates a device for echo cancellation and a device with calibration for echo cancellation are provided. Devices may be calibrated such that the echo residual error is less than a threshold determined by the calibration accuracy. Non-ideal factors such as mismatch may be eliminated during calibration.

Calibration for echo cancellation in a full duplex communication system

Embodiments relate to enhancing echo cancellation in a transceiver integrated circuit (IC) for full-duplex communication by providing a signal path connected to a dummy driver that replicates a signal path between a main driver and a counterpart transceiver IC to cause a duplicated signal generated by the dummy driver to more closely replicate a sending signal generated by the main driver. The signal path connected to the dummy driver includes circuit elements having transmission line parameters and RLC parameters that replicate transmission line parameters and RLC parameters of circuit elements in the signal path between the main driver and the counterpart transceiver IC.

Enhanced echo cancellation in full-duplex communication

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Shanghai, China

Kai Lei