Siemens Aktiengesellschaft

Curamik Electronics Gmbh

Rolls-royce Deutschland Ltd & Co. Kg

Kai Kriegel

Karl Weidner

Jürgen Schulz-Harder

Thomas Komma

Karl Exel

Michael Kaspar

Matthias Neumeister

Stefan Kiefl

Simon Hüttinger

Guy Lefranc

Julian Seidel

Stephan Geisler

Jürgen Rackles

Wolfgang Jarausch

Gernot Spiegelberg

The present disclosure relates to power modules. The teachings thereof may be embodied in a power unit and/or a drive unit for driving the power unit, along with methods for producing a power module. For example, a power module may include: a power unit including a heat sink; a power device disposed on the heat sink; an insulating layer covering the heat sink and the power device; and a drive unit for driving the power unit, the drive unit comprising a contact element corresponding to the contact area of the power unit. An underside of the power unit is defined by an underside of the heat sink. A top side of the power unit is defined by a contact area thermally and/or electrically coupled to the power device and a surface of the insulating layer surrounding the contact area. The contact element may be disposed abutting the contact area of the power unit for making electrical and/or thermal contact with the power device.

Power module having power device connected between heat sink and drive unit

A three-dimensional arrangement for a power converter device, e.g., an inverter or a rectifier, is provided. The switching elements, activation electronics, the load connections of the power converter device are arranged on a carrier device in such a way that defines especially short conduction paths. The components of the power converter device (e.g., all required components), such as switching elements, control electronics, and load connections, are arranged on a common carrier device. The carrier device is simultaneously used as a cooling device for the entire switching device. The power converter device may thereby achieve particularly efficient performance.

Power converter arrangement and method for producing a power converter arrangement

A method and a circuit functionally test a semiconductor component. The functional test is performed with galvanic isolation by using a transformer. The test itself is based on determining the frequency-dependent impedance of a series circuit of capacitors and inductors using the semiconductor component itself. The impedance is strongly influenced by the conduction state of the semiconductor component, in other words, by the instantaneous conductivity or blocking capability of the semiconductor component.

Galvanically isolated functional test for components

At least one power semiconductor component is cooled by a flat, copper, plate-type hollow body conducting a coolant fluid. Components are fixed on one flat-sided surface of the hollow body and the other flat-sided surface includes two coolant fluid openings for introducing the coolant fluid into the hollow body and for evacuating the fluid therefrom. The other flat-sided surface is concave and elastically deformable between the coolant fluid openings. The concave other surface is attached to the even surface of a support in such a way that the concave surface and the even surface are pressed against each other by the elastically planar deformation of the concave surface and that the coolant fluid openings are sealed in a fluidproof manner by O-rings. A solid strut, which interconnects the two flat-sided surfaces is additionally configured in the hollow body. The cooling device may be used in a module or an assembly including a support and the cooling device or module. The device is useful in electric transmissions, in particular, in motor vehicles.

Cooling devices for cooling electric components, module including cooling device and electric components, and assembly of cooling device or module and support

Growing community of inventors

Munich, Germany

Kai Kriegel