Hon Hai Precision Industry Co., Ltd.

Brazonics, Inc.

Kai Hou

A system for cooling electronic components includes a cold plate having a channel through which a fluid coolant is transported, a plurality of bosses each receiving an electronic, optical, or other heat-generating component, and a plurality of fin structures, at least three of which are adjacently disposed in a sequential order on the cold plate. Each fin structure contacts a boss, and has a fin inlet and a fin outlet in fluid communication with a section of the channel for supplying the area around the boss with coolant and cooling the component seated on the boss. A portion of the channel defines a serpentine path for transporting the fluid coolant to the at least three sequential fin structures in a non-sequential order. Sections of the channel in the serpentine path further transport the coolant in opposite directions, thus enhancing heat transfer and temperature equilibration across the cold plate. The system can further include a plurality of such cooling plates disposed in a vertical stack, and a manifold delivering coolant to the cooling plates. When the cooling plates are stacked, the flow rate and pressure drop across each plate is substantially uniform, thus providing a cold plate having a substantially isothermal surface across a portion of the cold plate.

Cold plate having uniform pressure drop and uniform flow rate

A method for making a ultra-thin fin heat sink includes the following steps. First, a continuous elongated heat sink bar is made by, the extrusion procedure wherein such heat sink bar is formed with a plurality of parallel closely spaced ultra-thin fins integrally extending from a base. Liquid type wax is injected into the space between every two adjacent fins until such space is completely filled with the wax. The wax is solidified after a while, and then the whole assembly including the heat sink bar with the inner wax generally becomes a whole solid reinforced structure which can bear the traditional sawing procedure. Via a fixture, the assembly is sawed/cut to pieces of the predetermined length. The cut pieces are successively heated to have the inner solid wax liquefied and leave from the heat sink unit.

Method for making heat sink having ultra-thin fins

A retaining clamp device (10) for use with a heat sink (40) of the CPU (50) unit includes a clip (12) and an associated spring (30) attached to the clip (12) wherein the clip (12) includes an elongated main body (14) with a pair of locking tags (18) downward extending at two opposite ends thereof to respectively cooperate with the lugs (62) on the side walls (64) of the socket (60) under the CPU (50) for latching the retaining clamp device (10) unto the CPU (50) set while the spring (30) is in a wave-like form and positioned between the main body (14) of the clip (12) and the top surface (48) of the heat sink (40) so as to exert the sufficient biasing force firmly pressing the heat sink (40) against the CPU (50) for efficient heat transfer thereof, by means of its deformation derived from the less space/height between the main body (14) of the clip (12) and the top surface (48) of the heat sink (40) in comparison with the original height of the spring (30).

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Chino Hill, CA, United States of America

Kai Hou