Asm Technology Singapore Pte Ltd

Asmpt Singapore Pte. Ltd.

Kai Fung Lau

Chi Wah Cheng

Yu Sze Cheung

Hing Suen Siu

Hoi Shuen Tang

Chi Hung Leung

A test handler comprising a primary rotary turret comprising pick heads for transporting electronic components, and a secondary rotary turret arranged and configured to receive electronic components directly or indirectly from the primary rotary turret, the secondary rotary turret including multiple separate test sectors having component carriers for carrying the electronic components received from the primary rotary turret, wherein the multiple test sectors are rotatably movable relative to one another. The test handler also comprises at least one testing device positioned along a periphery of the secondary rotary turret, wherein the component carriers of the respective test sectors are operative to convey the electronic components to a position of the at least one testing device for testing.

Test handler having multiple testing sectors

An apparatus for transferring electronic components, comprising a main rotary turret comprising a plurality of turret pick heads for conveying electronic components to multiple positions adjacent to the main rotary turret; a first rotary mechanism configured for picking up electronic components from a supply of electronic components, the first rotary mechanism being in operative communication with the main rotary turret at a first transfer position; and a second rotary mechanism that is in operative communication with the main rotary turret at a second transfer position, and which is further in operative communication with the first rotary mechanism at a third transfer position.

Apparatus for transferring electronic devices

An apparatus for placing ultra-small electronic devices into pockets on a carrier tape for packing has at least one holding element, a movement mechanism, a conveying mechanism and a positioning mechanism. The positioning mechanism further includes first and second positioning devices coupled to the conveying mechanism, wherein the second positioning device is mounted on the first positioning device. In use, the conveying mechanism conveys the carrier tape to move each pocket to a receiving position and the movement mechanism moves each holding element to place the electronic device into a respective pocket at the receiving position. The positioning mechanism adjusts a relative position between the electronic device and the respective pocket by adjusting the carrier tape, the first and second positioning devices being for coarse and fine positioning of the conveying mechanism respectively.

Apparatus for packing ultra-small electronic devices

A method for automated alignment between a plurality of electronic components and at least one testing device for receiving the electronic components for testing which includes defining a fiducial marker and positioning a moveable imaging device relative to a stationary imaging device, such that the fiducial marker is within a field of view of the moveable imaging device and within a field of view of the stationary imaging device. The moveable imaging device determines, with respect to each of the at least one testing device, a first offset between the testing device and the fidicual marker. The stationary imaging device determines, with respect to each electronic component, a second offset between the electronic component and the fidicual marker. Alignment is effected between each electronic component and the testing device in accordance with the first and second offsets.

Method and apparatus for aligning electronic components

A method for automated alignment of electronic components with respect to one or more inspection devices for inspecting the electronic components, each electronic component having a plurality of side surfaces. The method comprises: positioning each electronic component relative to an imaging device; determining, by the imaging device, an angular offset and a linear offset between each side surface of the electronic component and the one or more inspection devices; positioning each electronic component relative to the inspection devices; effecting alignment between each side surface and the one or more inspection devices in accordance with the respective angular and linear offsets; and inspecting each side surface after effecting alignment between the side surface and the inspection devices.

Method and apparatus for aligning and inspecting electronic components

Disclosed are an electrical contact for contacting an electrical component, an apparatus for testing an electrical component and a method of assembling an apparatus comprising an electrical contact for testing an electrical component. The electrical contact comprises a first member longitudinally extending and having an end, said first member having a first longitudinal side and a second longitudinal side; a second member having a first segment extending longitudinally adjacent to the first longitudinal side of the first member, a second segment extending longitudinally adjacent to the second longitudinal side of the first member, and a third segment extending substantially transverse to the first member and located adjacent to the end of the first member, the third segment being provided to couple the first segment to the second segment; wherein a continuous channel is defined between the first member and the second member such that the first member and the second member are electrically isolated from each other.

Electrical contact having electrical isolated members for contacting an electrical component

The present invention relates to an apparatus for transferring electronic devices from a holding unit to a processing station. The apparatus comprises first and second rotating mechanisms having a plurality of handlers and a plurality of holders respectively, an imaging mechanism, a processor and an adjusting mechanism. In use, a handler retrieves an electronic device from the holding unit and moves the device to a transfer position. A holder retrieves the electronic device from the handler at the transfer position and transfers the electronic device to the processing station. Prior to this retrieval, the adjusting mechanism adjusts a relative position between the holder and the handler at the transfer position. This adjustment is based on offsets calculated by the processor using images of the handler and holder captured by the imaging mechanism. The adjustment allows the electronic device to be retrieved more securely by the holder.

Apparatus and method for transferring electronic devices

A test handler comprises a main rotary turret and a loading station operative to convey electronic components to functional modules of the main rotary turret. An auxiliary rotary turret incorporating multiple carrier modules then receives electronic components from the functional modules of the main rotary turret. Multiple testing stations located along a periphery of the auxiliary turret are operative to receive electronic components from the carrier modules for testing while the loading station is concurrently conveying electronic components to the functional modules of the main rotary turret, so that the impact of transfer time is reduced or eliminated in a test process cycle of the test handler.

High throughput test handler system

A testing apparatus for electronic components comprises a mounting block and a plurality of contact strips arranged on the mounting block. The contact strips are configured such that electrical leads of an electronic component are operative to press against and bend the contact strips in a biasing direction to ensure good contact between the electrical leads and the contact strips during testing of the electronic component. Further, a preload block located on the mounting block is operative to contact and apply a pre-stress force onto the contact strips in the biasing direction prior to contact between the electrical leads and the contact strips.

Test contactor for electrical testing of electronic components

A transfer apparatus for transferring electronic devices from a wafer to a test handler. The transfer apparatus comprises: i) a rotary device rotatable about an axis; and ii) a plurality of holders configured to hold the electronic devices for transfer from the wafer to the test handler. The plurality of holders are coupled to, and extendable from, the rotary device to pick the electronic devices from the wafer. Specifically, the plurality of holders are arranged circumferentially around, and inclined with respect to, the axis of the rotary device, so as to change an orientation of the electronic devices on the wafer to a desired orientation of the electronic devices on the test handler.

Transfer apparatus for transferring electronic devices and changing their orientations

An apparatus for processing electronic devices includes a rotary turret having first device concentric around the rotary turret, which transfer the electronic devices; a rotary wheel having second device holders concentric around the rotary wheel, which receive the electronic devices and a processing device to process the electronic devices. The rotary turret rotates the first device holders along a first circular path, and the rotary wheel rotates the second device holders along a second circular path. The first axis of the rotary turret is perpendicular to the second axis of the rotary wheel, and that a projection of the second circular path of the second device holders in a direction perpendicular to the second axis of the rotary wheel onto the first circular path of the first device holders defines a line from the inside to the outside of the first circular path of the first device holders.

Growing community of inventors

Hong Kong, China

Kai Fung Lau