Taiwan Semiconductor Manufacturing Comp. Ltd.

Skymizer Taiwan Inc.

Global Advanced Packaging Technology H.k. Limited

Vate Technology Co., Ltd.

Kai-Chiang Wu

Chun-Lin Lu

Yen-Ping Wang

Shih-Wei Liang

Ching-Feng Yang

Chen-Hua Douglas Yu

Ming-Kai Liu

Chia-Chun Miao

Chuei-Tang Wang

Han-Ping Pu

Hsien-Wei Chen

Hao-Yi Tsai

Chao-Wen Shih

Yu-Feng Chen

Chung-Hao Tsai

Shou-Zen Chang

Vincent Chen

Shou Zen Chang

Ming-Che Ho

Fang-Yu Liang

Hung-Jui Kuo

Chun-Hung Lin

Tzu-Chun Tang

Mirng-Ji Lii

Hsin-Yu Pan

Wei-Ting Lin

Nan-Chin Chuang

Chung-Shi Liu

Ming-Da Cheng

Kuo-Chung Yee

Wei-Ting Chen

Jiun-Yi Wu

Sen-Kuei Hsu

Shu-Ming Liu

Che-Wei Hsu

Hao-Hsiang Chuang

Tuan-Yu Hung

Wen Li Tang

Yi-Wen Wu

Hung-Jen Lin

Albert Wan

Chung-Yi Hsu

Jiun Yi Wu

Jui-Pin Hung

Hsiu-Jen Lin

Meng-Tse Chen

Chih-Hang Tung

Chin-Liang Chen

Yu-min Liang

Yu-Peng Tsai

Chien-Ling Hwang

Chieh-Yen Chen

Chih-Chiang Tsao

Chien-Hsun Chen

Chi-Ming Huang

Yi-Che Chiang

Sheng-Ta Lin

Chia-Chia Lin

Shaw-Wei Chen

Yi-Liang Peng

Wei-Yu Chen

Ching-Hua Hsieh

Wei-Hung Lin

Chien-Hsun Lee

Chun-Cheng Lin

Yu-Min Liang

Chien-Hsiun Lee

Hsuan-Ting Kuo

Chia-Shen Cheng

Chia-Lun Chang

Chung-Ying Yang

Cheng-Shiuan Wong

Chien-Chang Lin

In-Tsang Lin

Hung-Jui Kou

Ya-Yun Cheng

Shih-wei Liang

Jen-ho Kuo

Chien-Fa Chen

An integrated circuit structure includes a metal pad, a passivation layer including a portion over the metal pad, a first polymer layer over the passivation layer, and a first Post-Passivation Interconnect (PPI) extending into to the first polymer layer. The first PPI is electrically connected to the metal pad. A dummy metal pad is located in the first polymer layer. A second polymer layer is overlying the first polymer layer, the dummy metal pad, and the first PPI. An Under-Bump-Metallurgy (UBM) extends into the second polymer layer to electrically couple to the dummy metal pad.

Polymer layers embedded with metal pads for heat dissipation

An interposer may comprise a metal layer above a substrate. A dam or a plurality of dams may be formed above the metal layer. A dam surrounds an area of a size larger than a size of a die which may be connected to a contact pad above the metal layer within the area. A dam may comprise a conductive material, or a non-conductive material, or both. An underfill may be formed under the die, above the metal layer, and contained within the area surrounded by the dam, so that no underfill may overflow outside the area surrounded by the dam. Additional package may be placed above the die connected to the interposer to form a package-on-package structure.

Methods and apparatus for package with interposers

A package structure includes a conductive feature structure, a die, an adhesive layer, an insulator, a through via, and an encapsulant. The die is disposed over the conductive feature structure. The adhesive layer is disposed below the die. The insulator is disposed between the adhesive layer and a polymer layer of the conductive feature structure. The through via extends through the insulator to connect to the conductive feature structure. The encapsulant is disposed on the insulator and the conductive feature structure, laterally encapsulating the die and the through via, and between the through via and the insulator. The insulator has a coefficient of thermal expansion less than a coefficient of thermal expansion of the encapsulant.

Package structure and method of manufacturing the same

An embodiment package comprises an integrated circuit die encapsulated in an encapsulant, a patch antenna over the integrated circuit die, and a dielectric feature disposed between the integrated circuit die and the patch antenna. The patch antenna overlaps the integrated circuit die in a top-down view. The thickness of the dielectric feature is in accordance with an operating bandwidth of the patch antenna.

Integrated devices in semiconductor packages and methods of forming same

A structure includes a die substrate; a passivation layer on the die substrate; first and second interconnect structures on the passivation layer; and a barrier on the passivation layer, at least one of the first or second interconnect structures, or a combination thereof. The first and second interconnect structures comprise first and second via portions through the passivation layer to first and second conductive features of the die substrate, respectively. The first and second interconnect structures further comprise first and second pads, respectively, and first and second transition elements on a surface of the passivation layer between the first and second via portion and the first and second pad, respectively. The barrier is disposed between the first pad and the second pad. The barrier does not fully encircle at least one of the first pad or the second pad.

Barrier structures between external electrical connectors

A semiconductor package and a manufacturing method thereof are provided. A package substrate of a device includes a functional circuit structure in a central region of the package substrate and a seal ring structure in a peripheral region of the package substrate and electrically isolated from the functional circuit structure. The seal ring structure includes a via pattern including outer discrete features arranged in an outer loop and inner discrete features arranged in an inner loop between the outer loop and the functional circuit structure. In a top view, ends of adjacent two of the inner discrete features are spaced apart from each other by a non-zero distance, and one of the outer discrete features overlaps the non-zero distance.

Semiconductor package and manufacturing method thereof

A semiconductor package and a manufacturing method are provided. The manufacturing method includes: forming a through via structure and a dipole structure over a carrier, wherein the through via structure and the dipole structure respectively include an insulating core and a conductive layer covering the insulating core; attaching a semiconductor die onto the carrier, wherein the through via structure and the dipole structure are located aside the semiconductor die; laterally encapsulating the though via structure, the dipole structure and the semiconductor die with an encapsulant; and removing the carrier.

A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes: patch antennas, encapsulated by a first encapsulant; a device die, vertically spaced apart from the patch antennas, and electrically coupled to the patch antennas; and at least one redistribution structure, disposed between the patch antennas and the device die, and including electromagnetic bandgap (EBG) structures laterally surrounding each of the patch antennas.

A package structure includes an insulating encapsulation, at least one semiconductor die, a redistribution circuit structure, and first reinforcement structures. The at least one semiconductor die is encapsulated in the insulating encapsulation. The redistribution circuit structure is located on the insulating encapsulation and electrically connected to the at least one semiconductor die. The first reinforcement structures are embedded in the redistribution circuit structure. A shape of the package structure includes a polygonal shape on a vertical projection along a stacking direction of the insulating encapsulation and the redistribution circuit structure, and the first reinforcement structures are located on and extended along diagonal lines of the package structure.

Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereof

Interconnect devices, packaged semiconductor devices and methods are disclosed herein that are directed towards embedding a local silicon interconnect (LSI) device and through substrate vias (TSVs) into system on integrated substrate (SoIS) technology with a compact package structure. The LSI device may be embedded into SoIS technology with through substrate via integration to provide die-to-die FL connection arrangement for super large integrated Fan-Out (InFO) for SBT technology in a SoIS device. Furthermore, the TSV connection layer may be formed using lithographic or photoresist-defined vias to provide eLSI P/G out to a ball-grid-array (BGA) connection interface.

Semiconductor devices and methods of manufacturing

A semiconductor package includes a redistribution layer structure, a first semiconductor chip, a circuit board structure and an encapsulation layer. The redistribution layer structure has a first side and a second side opposite to the first side. The first semiconductor chip is electrically connected to the first side of the redistribution layer structure. The circuit board structure is electrically connected to the first side of the redistribution layer structure, and the circuit board structure includes a first mask layer having an opening pattern that corresponds to first semiconductor chip. The encapsulation layer laterally encapsulates the circuit board structure and fills in a space between the semiconductor chip and the opening pattern of the first mask layer of the circuit board structure.

Semiconductor packages and forming methods thereof

Provided is a package structure and an antenna structure. The package structure includes a die; a first encapsulant, laterally encapsulating the die; a first redistribution structure, disposed on the first encapsulant and the die; a second encapsulant, disposed on the first redistribution structure; an antenna pattern, embedded in the second encapsulant and electrically connected to the first redistribution structure; and a dielectric layer, covering the antenna pattern, wherein an upper surface of the second encapsulant is exposed by the dielectric layer, and a laser mark is formed within the upper surface of the second encapsulant.

Package structure with antenna pattern

A method of manufacturing a semiconductor device includes providing a semiconductor die and surrounding a sidewall of the semiconductor die with a dielectric material. The method further includes forming a post passivation interconnect (PPI) over the semiconductor die and electrically coupling the PPI with the semiconductor die. The method further includes molding the semiconductor die and the PPI into an integrated semiconductor package. The method further includes covering at least a portion of an outer surface of the integrated semiconductor package with a conductive layer, wherein the conductive layer is conformal to the morphology of the portion of the outer surface. Moreover, the method further includes forming a conductive path inside the integrated semiconductor package electrically coupled to the conductive layer and a ground terminal of the integrated semiconductor package.

Manufacturing method of a semiconductor device

A memory apparatus and a data rearrangement method for computing in memory (CIM) are provided. The method includes determining whether first sequence data has two target bits that are both of a first value, inserting a non-target bit of a second value between the two target bits that are both of the first value and adjacent to each other to generate second sequence data, and receiving the second sequence data through memory cells in a memory to perform a multiply-accumulate (MAC) operation on the second sequence data. Each bit in the first sequence data is the first value or the second value. One of the two target bits is located adjacent to the other one of the two target bits in the first sequence data. The two target bits and the non-target bit are located in the first sequence data. Accordingly, the error rate is decreased.

Memory apparatus and data rearrangement method for computing in memory

An embodiment is a device including an integrated circuit die having an active side and a back side, the back side being opposite the active side, a molding compound encapsulating the integrated circuit die, and a first redistribution structure overlying the integrated circuit die and the molding compound, the first redistribution structure including a first metallization pattern and a first dielectric layer, the first metallization pattern being electrically coupled to the active side of the integrated circuit die, at least a portion of the first metallization pattern forming an inductor.

Semiconductor packages having a die, an encapsulant, and a redistribution structure

Growing community of inventors

Hsinchu, Taiwan

Kai-Chiang Wu