Aac Kaitai Technologies (wuhan) Co., Ltd

Aac Acoustic Technologies (shenzhen) Co., Ltd.

Aac Technologies Pte. Ltd.

Kahkeen Lai

Zhan Zhan

Hui Zhang

Shan Yang

Veronica Tan

Zhao Ma

Xiao Kan

Hongtao Peng

Shitao Yan

Yan Hong

Lieng Loo

Wooicheang Goh

Xiaohui Zhong

Qiang Dan

Chungmin Li

KianHeng Goh

Lian Duan

Bei Tong

Shaoquan Wang

Yilei Wu

Yang Li

Kianheng Goh

Lanlan Tu

Ping-He Chang

Shrowthi S N Bharadwaja

A method for manufacturing a MEMS device and the MEMS device are provided. The method includes: depositing a film on at least a part of a surface of a sacrificial layer, defining at least one through hole in the thin film by machining, removing at least a part of a material covered by the thin film in the sacrificial layer, discharging the part of the material removed from the sacrificial layer from the at least one through hole to define a cavity in the sacrificial layer, and depositing a sealing layer on a surface of the thin film facing away from the sacrificial layer to seal the at least one through hole. Compared with the manufacturing method in the related art, the manufacturing method of the disclosure only requires to deposit one layer of thin film, shorten the production period, and has reliable on-site sealing capability.

Method for manufacturing MEMS device and MEMS device

Provided is a method for manufacturing a MEMS acoustic sensor. A structural layer and a piezoelectric material layer are stacked on the substrate. Photolithography modeling is performed on the piezoelectric material layer and the structural layer. A polymer layer is stacked on the piezoelectric material layer. The substrate is etched to form a cavity. A first part of a jig is stacked on the polymer layer. The jig, the substrate, the piezoelectric material layer, and the polymer layer are heated. Air is introduced into the cavity and a pressure inside the cavity is controlled. An atmospheric pressure load of the air is maintained and the air is cooled. The pressure inside the cavity is stopped to be controlled and the pressure inside the cavity is reduced, the jig is disassembled, and a wafer is cut to obtain the MEMS acoustic sensor, to effectively improve the accuracy and reliability in processing.

Method for manufacturing MEMS acoustic sensor

A three-axis MEMS gyroscope includes a substrate, a sensing unit connected with the substrate, and a driving unit driving the sensing unit to move. The substrate includes anchor point structures and coupling structures connected with the anchor point structures. The driving unit includes driving pieces. One ends of each of the driving pieces are elastically connected with an adjacent coupling structure. The sensing unit includes X and Y mass blocks and Z mass blocks. Each of the X and Y mass blocks is arranged in a corresponding avoiding space. The X and Y mass blocks are respectively connected with adjacent coupling structures to form a rectangular frame. The Z mass blocks are connected with the driving pieces and separately arranged on one side of each driving piece away from each anchor point structure. The three-axis MEMS gyroscope is differentially driven, which realizes differential detection and reduces quadrature error.

Three-axis MEMS gyroscope

An acoustic transducer includes: substrate including first silicon layer, first oxide layer and second silicon layer, back chamber is formed therethrough; second oxide layer on the substrate; piezoelectric unit on the second oxide layer and including first electrode layer, piezoelectric layer and second electrode layer; slit and opening formed in the second electrode layer; metal pad stacked on the first electrode layer at the opening; and additional film layer including first, second and third parts, the first part is in the slit, side wall and bottom wall of the first part form groove, and through slot is formed in the third part to expose metal pad.

Acoustic transducer and method for manufacturing acoustic transducer

The invention discloses a MEMS gyroscope, including a substrate, a first unit and a second unit, and the first unit and the second unit are relatively arranged on the substrate along the first direction. The first unit is connected to the second unit through a coupling spring, and the substrate is also provided with a driving electrode and a detection electrode. The first unit includes a first weight and a second weight. The second unit includes the third weight and the fourth weight set oppositely along the second direction. The second set of coupling structures are connected to the third weight and fourth weight. Compared with the prior art, the beneficial effect of the present invention is that the MEMS gyroscope adopts a symmetrical layout, which facilitates the realization of differential detection and improves the sensitivity.

MEMS gyroscope

An acoustic transducer includes: substrate including first silicon layer, first oxide layer and second silicon layer, back chamber is formed therethrough; second oxide layer on the substrate; piezoelectric unit on the second oxide layer and including first electrode layer, piezoelectric layer and second electrode layer; slit and opening formed in the second electrode layer; metal pad stacked on the first electrode layer at the opening; and additional film layer including first and second parts, the first part is lay on the second electrode layer and covers the slit, and the second part is lay on the metal pad, through slot is formed penetrating the second part to expose the metal pad. Compared with the related art, additional film layer is formed by vapor deposition, and the piezoelectric unit can vibrate with maximum displacement and lowest restriction, thereby effectively improving SPL and structural reliability, which is suitable for larger acoustic transducers.

Provided is a fully decoupled MEMS gyroscope, including an anchor point unit, a sensing unit elastically connected to the anchor point unit, and a driving unit configured to drive the sensing unit to move. The anchor point unit includes a center anchor point subunit located at a center of a rectangle and four side anchor points. The driving unit includes four driving members located on four sides of the rectangle. The sensing unit includes two X mass blocks symmetrically arranged in two avoiding intervals, two Y mass blocks symmetrically arranged in the other two avoiding intervals, four Z mass blocks respectively located at an outer side of each driving member, and four Z detection decoupling members respectively located at an outer side of each Z mass block. The X mass blocks and the Y mass blocks are respectively connected to each side anchor point.

Fully decoupled three-axis MEMS gyroscope

A micromachined gyroscope and an electronic product are provided. The micromachined gyroscope includes a driving component, a detecting component, first connecting components, and second connecting components. The driving component includes first driving pieces, second driving pieces, and driving devices driving the first driving pieces and the second driving piece to move. The detecting component includes first detecting pieces arranged along a third direction, second detecting pieces arranged along a fourth direction, and detecting devices for detecting movement distances of the first detecting pieces and/or the second detecting pieces along a fifth direction. Each of the first connecting pieces and the second connecting pieces rotates around a center thereof, so the second detecting pieces and the first detecting pieces respectively reciprocate along the third direction and the fourth direction. The micromachined gyroscope and the electronic product realize differential detection and effectively avoid influence of acceleration shock and quadrature error.

Micromachined gyroscope and electronic product

A MEMS gyroscope for three-axis detection relates to the technical field of gyroscope and includes a substrate, a sensing unit elastically connected with the substrate, and a driving unit coupled with the sensing unit and driving the sensing unit to move. The substrate includes anchor point structures respectively located at four corners of the substrate and four coupling structures respectively elastically connected with the four anchor point structures. An avoiding space is formed between two adjacent coupling structures. The driving unit includes two driving pieces separately elastically connected with adjacent coupling structures. The two driving pieces are symmetrically arranged and are frame-shaped. The sensing unit includes four X and Y mass blocks, two Z mass blocks elastically connected with the driving pieces, and two decoupling mass blocks. The two decoupling mass blocks are elastically connected. The MEMS gyroscope is differentially driven, which realizes differential detection and reduces quadrature error.

MEMS gyroscope for three-axis detection

A micromechanical gyroscope and an electronic device are related. The micromechanical gyroscope includes a first movement member, a second movement member, many drive members and a detection member, the first movement member has a first center, with two ends along a second direction oscillating around the first center along a first and a third directions, the second movement member has a second center, with two ends along the first direction oscillating around the second center along the second and third directions. The drive members can drive oscillations of the first and second movement members. The detection member is located above or below the first and second movement members in the third direction, to detect moving distances of the first and second movement members along the third direction. The micromechanical gyroscope can detect angular velocities in two directions simultaneously and perform differential detection to reduce errors, thus expanding application scenarios.

Micromechanical gyroscope and electronic device

The invention provides a micromachined gyroscope. The micromachined gyroscope includes a driving structure, a detection structure and a connection component. The driving structure includes a first moving component and a driving component. The driving component is used to drive the movement of the first moving component. The detection structure includes a second moving component and a detection component installed in the second moving component. The detection component is used to detect the movement distance of the second moving component along the third or fourth direction. The driving component is installed inside the first moving component, and the detection component is installed inside the second moving component. Greater drive of amplitude can be achieved at the same drive voltage, thereby increasing the sensitivity of the micromachined gyroscope.

Micromachined gyroscope and electronic product using same

A MEMS gyroscope includes an anchor point, at least two driving structures connected with the anchor point; a mass group connected with the driving structures, and coupling beams connected with adjacent driving structures. The mass group includes two detecting components arranged on opposite sides of the driving structures and connected with the driving structures. Each of the detecting components includes two mass blocks arranged at intervals and detecting transducers arranged below or above the mass blocks. The mass blocks are connected with the driving structures. At least portions of the mass blocks extend to outsides of the driving structures. The mass blocks and the detecting transducers are symmetrically arranged, which is convenient for realizing differential detection. In an out-plane oscillation mode, most portions of the mass blocks sense an angular velocity. By adopting detecting transducers, electromechanical coupling coefficient of detection is effectively improved, and sensitivity and signal-to-noise ratio are improved.

A MEMS gyroscope includes an anchor point, a resonator, and a transducer. The resonator includes eight resonating blocks arranged at equal intervals and a coupling beam connecting each two adjacent resonating blocks. The resonating blocks are connected with the anchor point through anchoring beams. The anchoring beams decouple radial motion and circumferential motion of the resonating blocks. The resonating blocks include first resonating blocks, second resonating blocks, third resonating blocks, and fourth resonating blocks. In a vibration mode, the transducer drives the first and second resonating blocks to vibrate along a first axis and a second axis respectively, so the third and fourth resonating blocks are driven to vibrate along the fourth axis and the third axis respectively. In a detection mode, the transducer detects vibration of the third resonating blocks along the third axis and the vibration of the fourth resonating blocks along the fourth axis.

A MEMS single-axis gyroscope includes an anchor point structure, a sensing unit elastically connected with the anchor point structure, and a driving decoupling structure elastically connected with the anchor point structure and the sensing unit. The sensing unit includes a plurality of mass blocks arranged side by side and rocker connecting pieces. Each of the rocker connecting pieces is connected between corresponding two adjacent mass blocks. Connecting positions between each of the rocker connecting pieces and the corresponding two adjacent mass blocks are located on a same side of the line connecting the centers of the plurality of mass blocks. The MEMS single-axis gyroscope is able to perform differential detection, which resists interference of external electrical and mechanical noise, and improves a signal-to-noise ratio. By adjusting the rocker connecting pieces arranged between each two adjacent mass blocks, a total vector displacement of the plurality of mass blocks is zero.

MEMS single-axis gyroscope

A MEMS accelerometer includes a base, proof mass, at least one pair of seesaw structures, and an out-of-plane displacement detection component. The at least one pair of the seesaw structures are oppositely disposed and fixed on the base through anchor points, and the out-of-plane displacement detection component is configured to detect rotation of the at least one pair of the seesaw structures or out-of-plane linear motion of the proof mass. Linear displacement of the MEMS accelerometer is not only beneficial to improve linearity of a capacitive displacement detection, but also to other non-capacitive detection methods, such as optical displacement detection. In addition, a double coupling structure is adopted to jointly couple rotation of seesaws, and remaining translational and rotational modes of the seesaw structures are suppressed.

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Singapore, Singapore

Kahkeen Lai