Intel Corporation

Kabul S Sengupta

Zong-Fu Li

Edward John Bawolek

Azar Assadi

Deborah L Thompson

Parvin Mossahebi

Curtis A Corum

Robert C Sundahl

Naoyuki Nagai

Raul A Arellano

Carl E Sklenicka

Nobuyuki Takehashi

Alan B Alley

Kouichiro Nomoto

An integrated circuit (IC) package includes a mold compound, a die, and a window. The mold compound has a frame embedded within it. The frame has a top surface, a bottom surface, and a top-to-bottom opening therein. The die is attached to the mold compound, wherein the embedded frame lies below a periphery of the die. The window is attached to the mold compound and located above the die to allow light to reach the die.

Windowed package having embedded frame

An imaging system includes an image sensor that is attached to a circuit board via a mass reflow process. The image sensor captures image data and provides the image data at an output of the imaging system. In one embodiment, the image sensor uses a color filter array (CFA) material that is substantially stable through the mass reflow process.

Image sensor mounted by mass reflow

An integrated circuit (IC) package includes a mold compound, a die, and a window. The mold compound has a frame embedded within it. The frame has a coefficient of thermal expansion that is less than the mold compound. The IC package is capable of being attached to a circuit board via a mass reflow process.

Windowed non-ceramic package having embedded frame

An image sensing device including an imaging sensor, a package having opposing side portions, and an infrared light selective element coupled to the opposing side portions and overlying a top side portion of the imaging sensor, the selective element including a plastic element and a dye.

Plastic light selective element for imaging applications

A photosensitive device with a microlens array may be packaged for surface mount packaging and subsequent mass reflow processing without significantly degrading the optical performance of the microlens. The microlens may be formed using a series of heat steps of increasing time and temperature. In addition, the microlens may be bleached to prevent degradation of its optical transmissivity at temperatures normally associated with surface mount techniques.

Microlens for surface mount products

A windowed package is capable of withstanding a mass reflow process. During mass reflow, the entire package is subjected to the solder reflow temperature. In one embodiment, the lid comprises a ceramic frame and a glass window.

Mass reflowable windowed package

An image sensing device including a package having opposing side portions, an imaging sensor having a top side portion, and a light selective element coupled to the opposing side portions and overlying the top side portion of the imaging sensor.

Light selective element for imaging applications

An imaging system having an imaging sensor providing sensor signals in response to incident light and control signals, control circuitry configured to generate control signals for controlling said imaging sensor, signal processing circuitry for generating image data in response to said sensor signals, and a light selective element for selecting the incident light encountered by said imaging sensor, the light selective element comprising an ionically-colored glass having a surface that is treated with a chemical stabilizer.

Chemically stabilized light selective element for imaging applications

A sensor device, an imaging system, and a method of forming a sensor device. The sensor device includes an integrated circuit having a sensor portion and non-sensor portion disposed about the periphery of the sensor portion, a passivation layer overlying a portion of a top surface of the non-sensor portion of the integrated circuit, and a protection layer overlying the passivation layer.

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Tempe, AZ, United States of America

Kabul S Sengupta