Intel Corporation

Tokyo Electron Limited

Kabirkumar Mirpuri

Xavier Francois Brun

Saikumar Jayaraman

Edward Rudolph Prack

Dingying David Xu

Sandeep Razdan

Nisha Ananthakrishnan

Masatoshi Deguchi

Masatoshi Shiraishi

Mihir A Oka

Shinji Okada

Sivakumar Nagarajan

Charles Wayne Singleton, Jr

Craig Jonathan Weinman

A superposed wafer is separated to a processing target wafer and a supporting wafer while being heated. Then, an adhesive on a joint surface of the processing target wafer is removed by supplying an organic solvent onto the joint surface of the processing target wafer. Then, an oxide film formed on the predetermined pattern on the joint surface of the processing target wafer is removed by supplying acetic acid to the joint surface of the processing target wafer. Then, the joint surface of the processing target wafer is inspected. Then, based on an inspection result, the adhesive on the joint surface of the processing target wafer is removed and the oxide film formed on the predetermined pattern on the joint surface of the processing target wafer is removed.

Separation method, computer storage medium, and separation system

This disclosure relates generally to generating a solder-on-die using a water-soluble resist, system, and method. Heat may be applied to solder as applied to a hole formed in a water-soluble resist coating, the water-soluble resist coating being on a surface of an initial assembly. The initial assembly may include an electronic component. The surface may be formed, at least in part, by an electrical terminal of the electronic component, the hole being aligned, at least in part, with the electrical terminal. The solder may be reflowed, wherein the solder couples, at least in part, with the electrical terminal.

Solder-on-die using water-soluble resist system and method

A fluxing-encapsulant material and method of use thereof in a thermal compression bonding (TCB) process is described. In an embodiment, the TCB process includes ramping the bond head to 250&#xb0; C.-300&#xb0; C. at a ramp rate of 50&#xb0; C./second-100&#xb0; C./second. In an embodiment, the fluxing-encapsulant material comprising one or more epoxy resins having an epoxy equivalent weight (EEW) of 150-1,000, a curing agent, and a fluxing agent having a mono-carboxylic acid or di-carboxylic acid and a pKa of 4-5.

Fluxing-encapsulant material for microelectronic packages assembled via thermal compression bonding process

An electronic device including a solder structure and methods of forming an electrical interconnection are shown. Solder structures are shown including a solder ball formed from a first solder having a first melting temperature, and a connecting structure coupling the solder ball to one or more electrical connection pads, the connecting structure formed from a second solder having a second melting temperature lower than the first melting temperature. Electronic devices are shown including a polymer mold material formed over the solder structures.

Solder attach apparatus and method

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Scottsdale, AZ, United States of America

Kabirkumar Mirpuri