Sae Magnetics (h.k.) Limited

Ka Yip Wong

Chi Hung Yuen

Seiichi Takayama

Ryuji Fujii

Ryo Hosoi

Yasutoshi Fujita

Tai Boon Lee

Taku Kosuge

The disclosure disclose a light source unit applied to the thermally assisted magnetic head. A welding layer and a stopping structure are disposed between the slider of the thermally assisted magnetic head and the light source unit. When the light source unit is joined with the slider, the light source unit moves as the welding layer melts and can be precisely limited at the preset position by the stopping structure. In this way, the emission opening of the light source unit and the waveguide can be aligned precisely, thereby increasing the optical coupling efficiency between the light source unit and the waveguide. Meanwhile, the embodiment of the disclosure further accordingly provides a thermally assisted magnetic head, a head gimbal assembly, and a hard disk drive.

Light source unit, thermally assisted magnetic head, head gimbal assembly, and hard disk drive

The disclosure provides a thermally assisted magnetic head comprising a slider and a light source unit provided on the slider. An intermediate connection pad is provided in such a manner that the first light source connection pad and the second light source connection pad of the slider are arranged in a row on a straight line while the intermediate connection pad is not located on the said straight line. The first electrode of the light source unit is electrically connected with the first light source connection pad, and both the second electrode of the light source unit and the second light source connection pad are electrically connected with the intermediate connection pad. Accordingly, a head gimbal assembly and a hard disk drive are further provided in the embodiment of the disclosure.

Thermally assisted magnetic head, head gimbal assembly, and hard disk drive

A thermally assisted magnetic head includes a slider having a slider substrate and a magnetic head part, and a light source unit having a laser diode and a sub-mount. The magnetic head part includes a medium-opposite surface, a light source-opposite surface, and a slider-front end surface. The sub-mount includes a joined-end surface and a mount-front end surface, the laser diode includes an electrode surface and an LD-front end surface. The light source unit includes a shift joined structure which the laser diode is joined to a shift area of the joined-end surface, and the light source unit is mounted on the slider substrate so that the electrode surface intersects with a laminated surface of the magnetic head part. The shift area is set in a position which is shifted so that the LD-front end surface is away from the slider-front end surface than the mount-front end surface.

Thermally assisted magnetic head, light source unit bar like member, and hard disk drive

A method of manufacturing a head gimbal assembly includes a head connecting step which a thermally assisted magnetic head is connected to a suspension. The head connecting step includes a solder ball arrangement step which only one solder ball is arranged so that a laser diode of the thermally assisted magnetic head is connected to a flexure of the suspension, in an assembly structure which a slider of the thermally assisted magnetic head is adhered to the suspension. The solder ball arrangement step is performed using a connecting ball, as the solder ball, having a size larger than a wiring gap between an electrode surface of the laser diode and the flexure, and being in unmelted-solid condition.

Method of manufacturing head gimbal assembly, head gimbal assembly and hard disk drive

A method of manufacturing a head gimbal assembly includes a head connecting step which a thermally assisted magnetic head is connected to a suspension. The head connecting step includes a solder ball arrangement step which only one solder ball is arranged so that a laser diode of the thermally assisted magnetic head is connected with a flexure of the suspension, in an assembly structure which a slider of the thermally assisted magnetic head is adhered to the suspension. The solder ball arrangement step is performed using a connecting ball, as the solder ball, having a size larger than a wiring gap and being in unmelted-solid condition. The head connecting step includes a heat step which an electrode surface of the laser diode is heated.

A method of manufacturing a head gimbal assembly includes a head connecting step which a thermally assisted magnetic head is connected to a suspension. The head connecting step includes a solder ball arrangement step which a solder ball is arranged so that a laser diode of the thermally assisted magnetic head is connected to a flexure of the suspension, in an assembly structure which a slider of the thermally assisted magnetic head is adhered to the suspension. The solder ball arrangement step is performed using a connecting ball, as the solder ball, having a size smaller than a wiring gap between an electrode surface of the laser diode and the flexure, and being in melted-particle condition.

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Hong Kong, China

Ka Yip Wong