Industrial Technology Research Institute

Ka-Yi Yeh

Shang-Fu Yeh

Chun-Lung Lin

Chih-Cheng Hsieh

Shau-Yin Tseng

Chung-Chi Li

An exposing method adapted to a maskless photolithography process. The exposing method includes reading an exposure file; obtaining a plurality of coordinate information corresponding to a plurality of patterns contained in the exposure file, according to the exposure file; generating graphical data, according to the plurality of coordinate information; generating scanning data corresponding to each of a plurality of polygon mirrors or each of at least one polygon mirror group, according to the graphical data and a configuration of the polygon mirrors, wherein every two rotation directions of every two adjacent polygon mirrors of the plurality of polygon mirrors are different, or every two rotation directions of every two adjacent polygon mirrors of the at least one polygon mirror group are different.

Exposing method, exposing system and laser direct imaging system

A pixel array module with a self-test function including a test circuit unit, a plurality of test lines, and a pixel array is provided. The test circuit unit provides the self-test function. The test lines are connected between the test circuit unit and the pixel array. The pixel array is connected to the test circuit unit through the test lines and includes a plurality of pixels. Each pixel includes a transistor. Each transistor has a first terminal and a second terminal. Regarding each of the pixels, a driving signal of the transistor is transmitted from the first terminal to the second terminal thereof under a normal mode, and a test signal of the transistor is transmitted from the second terminal to the first terminal thereof under a test mode. Furthermore, a self-test method of the foregoing pixel array module is also provided.

Pixel array module with self-test function and method thereof

An image pickup apparatus and a method thereof are provided. The apparatus includes a sensor array and an ADC array. The sensor array includes M&#xd7;N sensor blocks SB(i,j). The sensor block includes P&#xd7;Q image sensing elements Se(x,y). The ADC array is located at another side of the illuminated side of the sensor array. The ADC array includes M&#xd7;N ADCs ADC(i,j). The ADC(i,j) coupled to the sensor block SB(i,j) obtains the image data Data(x,y) from the image sensing element Se(x,y) of the sensor block SB(i,j). The ADC(i,j) evaluates the gain G(x,y) based on the position of the image sensing element Se(x,y). The compensated image data Datacom(x,y) can be outputted and Datacom(x,y)=Data(x,y)&#xd7;G(x,y). The image pickup apparatus could improve the optical shading problem.

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Hsinchu, Taiwan

Ka-Yi Yeh