Asm Technology Singapore Pte Ltd

Asmpt Singapore Pte. Ltd.

Ka Shing Kwan

Yam Mo Wong

Keng Yew Song

Yue Zhang

Xiao Liang Chen

Ting Yu He

Phui Phoong Chuang

Jun Wan

Hasrul Bin Hasim

Wan Azmi

Siti Nurulhaida Bt Ramlan

Xiang Li

See Yap Ong

Rong Duan

Wei He

Hing Leung Li

Tingyu He

Yan Dong Sun

Guoshen Hu

Kun Quan Fan

Yie Mi

Chu Fan Feng

Tin Kwan Chan

Hon Yu Ng

Ajit Shriman Gaunekar

Zhi Tao Wang

Ping Kong Choy

Zhenyong Bai

Huawei Guan

Jinchun Huang

An apparatus for attenuating vibration of a support structure for supporting a movable module that is drivable to move on the support structure. The support structure is isolated from a base by a resilient vibration isolator. The apparatus includes a force compensation system coupled to the support structure for applying one or more first vibration suppression forces on the support structure for at least partially canceling a reaction force exerted by the movable module when the movable module is driven to move on the support structure, and a sensing system attached to the support structure for measuring a vibration parameter of the support structure, wherein the force compensation system is further configured to apply at least one second vibration suppression force on the support structure according to the measured vibration parameter for attenuating vibration of the support structure.

Apparatus and method for vibration attenuation

A device for measuring a force applied to a component when the component is being bonded to a component carrier, or when the component is being encapsulated includes a deformable portion and a contacting stem connected to the deformable portion. The deformable portion is configured to incorporate a sensor for detecting a degree of deformation of the deformable portion caused by application of the force in order to measure the force. In use, the contacting stem is positionable to contact the component or the component carrier so that the deformable portion is deformed when the force is applied to the component. One or more such devices may be included in a sintering or encapsulation apparatus for measuring the said force.

Force measurement device and method for bonding or encapsulation process and apparatus incorporating the device

A driving system has a driving motor body operative to produce a driving force for driving an object to move in reciprocating directions. A pivotal support is located between the driving motor body and a machine base for supporting the driving motor body on the machine base. The pivotal support causes at least a portion of the driving motor body to rotate relative to the machine base in an opposite direction to a direction of the driving force produced by the driving motor body to drive the object, so as to reduce vibration transmission to the machine base.

Driving system having reduced vibration transmission

A wire bonding apparatus comprises an ultrasonic transducer including a capillary, a flexible connecting frame having a first side to which the ultrasonic transducer is connected and at least one electrically-driven actuator which is connected to a second side of the flexible connecting frame that is opposite to the first side thereof, the actuator having a longitudinal actuation direction. An elongated slit located in the flexible connecting frame extends substantially transversely to the actuation direction of the at least one actuator to form at least one pivot point adjacent to an end of the slit about which the flexible connecting frame is rotatable when it is driven by the at least one actuator.

Wire bonding apparatus comprising an oscillator mechanism

An SMT screen printeris disclosed herein. In a described embodiment, the screen printercomprises: i) a stencilwith a plurality of apertures; ii) a paste dispenser arranged to dispense a paste material through the plurality of apertures of the stencil to form a print pattern of the stencil to form a print pattern of the paste material on an electronic device; iii) an image capturing device in the form of a fiducial cameraarranged to capture at least one image of the plurality of aperturesof the stencil; iv) a processorarranged to select which of the aperturesrequire cleaning based on the at least one captured image; and v) a cleaning devicearranged to clean the selected apertures. A method of cleaning a stencilof an SMT screen printeris also disclosed.

Screen printer, and method of cleaning a stencil of a screen printer

A lead frame support plateand a window clampfor wire bonding machines are disclosed herein. In a described embodiment, the lead frame support plateincludes a network of suction groovesprovided on a support surface, each suction groovebeing arranged to be in fluid communication with at least a vacuum holeto enable a suction force to be created, in response to a vacuum force, along the network of suction grooves for holding a lead frame against the support surface. A window clamphaving slots for compensating deformation of the window clamp and a method of fabricating the lead frame support plate are also disclosed.

Lead frame support plate and window clamp for wire bonding machines

Disclosed is an apparatus for mounting a transducer to a bond head of a wire bonder. In particular, the bond head of the wire bonder is operative to mechanically drive the transducer when forming electrical interconnections between separate locations within a semiconductor package. Specifically, the apparatus comprises: i) a flexural structure having a connector for connecting to the transducer, the flexural structure being configured to bend; and ii) at least one actuator attached to the flexural structure, the at least one actuator being operative to bend the flexural structure to thereby cause a displacement of the transducer connected thereto via the connector.

Wire bonder including a transducer, a bond head, and a mounting apparatus

The invention provides an apparatus and a method for forming conductive bumps on a plurality of semiconductor devices with an oxidizable material. The apparatus comprises a bump forming device, a chamber system adapted to house the semiconductor devices and a gas supply for supplying an inert gas into the chamber system. A support table is provided for supporting the semiconductor devices during bumping, and the said support table is operative to move the semiconductor devices from a bumping site into the chamber system after bumping.

Stud bumping apparatus

A clamping device is provided for holding an electronic device, such as a semiconductor carrier in the form of a leadframe, during processing thereof. It includes a main body for covering the electronic device and an opening in the main body for providing access to a part of the electronic device to be worked upon. A support structure is attachable for coupling it to a periphery of the opening whereby the support structure is extended across the opening for supporting the part of the electronic device that is accessible through the opening.

Clamping device for processing electronic devices

The invention provides a wire-bonding apparatus for forming electrical connections between a semiconductor chip and a leadframe, comprising a plurality of bond-heads associated with a plurality of work holders on said wire bonding apparatus for holding a plurality of leadframes, wherein each bond-head of the apparatus is capable of independent bonding operation simultaneously with the other bond-heads, without synchronization of movement with the other bond-heads.

Multiple-head wire-bonding system

Growing community of inventors

Singapore, Singapore

Ka Shing Kwan