Hahn-schickard-gesellschaft Fur Angewandte Forschung E.v.

Würth Elektronik Gmbh &Co. Kg

Wurth Electronik Gmbh & Co.

Würth Elektronik Rot Am See Gmbh & Co. Kg

Jürgen Wolf

Jan Kostelnik

Alina Schreivogel

Jürgen Keck

Metin Giousouf

Albert Kiessling

Ing Metin Giousouf

Thomas Reininger

Rer Nat Thomas Reininger

Ing Albert Kiessling

Jörg Murawski

The invention relates to a method for producing a coil integrated in a substrate or applied to a substrate, wherein the coil has first winding portions, which each have first ends and second ends, and wherein the coil has second winding portions and third winding portions, wherein each two of the first ends are electrically interconnected by the second winding portions and two corresponding second ends of the first winding portions are electrically interconnected by the third winding portions, such that coil windings of the coil are formed hereby, wherein at least the first winding portions are applied by means of a 3D printing method, wherein this is aerosol jet or inkjet printing, for example.

Method for producing a coil and electronic device

The invention relates to a method for producing an optical module, comprising the following steps: a) providing a chip having an optical element integrated in the chip, wherein the optical element bas a first electrode and a second electrode, and wherein the chip has a first connection contact for the first electrode and a second connection contact for the second electrode, such that an operating voltage for the optical element can be applied between the first connection contact and the second connection contact, and wherein the chip has an optically active side, which is designed to emit and/or to receive radiation; b) connecting the chip to a film, such that the film completely covers the optically active side of the chip, wherein the film is a film made from acrylate, polyarylate, or polyurethane, wherein the film, at least in the region located above the optically active side, is transparent to radiation which. when operating voltage is applied, can be emitted or received by the optical element; c) contacting the first connection contact of the chip by means of a conducting track arranged on the film and contacting the second connection contact by means of an additional conducting track.

Method for producing an optical module

The invention relates to a method for producing a coil () integrated in a substrate () or applied to a substrate, wherein the coil has first winding portions (), which each have first ends () and second ends (), and wherein the coil has second winding portions () and third winding portions (), wherein each two of the first ends are electrically interconnected by the second winding portions and two corresponding second ends of the first winding portions are electrically interconnected by the third winding portions, such that coil windings of the coil are formed hereby, wherein at least the first winding portions are applied by means of a 3D printing method, wherein this is aerosol jet or inkjet printing, for example.

Method for producing a coil

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Kupferzell, Germany

Jürgen Wolf