Ams Sensors Singapore Pte. Ltd.

Jürgen Soechtig

Hartmut Rudmann

Nicola Spring

Alexander Bietesch

The invention relates to wafer-level manufacturing of optical devices such as modules comprising micro-lenses. In one aspect, passive optical components such as truncated lenses are manufactured by providing a substrate on which a multitude of precursor optical structures is present; and removing material from each of said multitude of precursor optical structures. Another aspect comprises a method for manufacturing a device comprising a set of at least two passive optical components, said method comprising the steps of using a tool obtained by carrying out the steps of manufacturing a precursor tool having a replication surface; and modifying said replication surface by removing material from said precursor tool. An yet another aspect comprises a method for manufacturing a device comprising a set of at least two passive optical components, wherein the method comprises the step of using a master comprising a replication surface comprising, for each of said passive optical components, a first portion describing a shape corresponding to the shape of at least a portion of the respective passive optical component, wherein the master comprises, in addition, at least one protruding portion protruding from at least one of said first portions of said replication surfaces.

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Wettswil, Switzerland

Jürgen Soechtig