Curamik Electronics Gmbh

Rogers Germany Gmbh

Electrovac Ag

Siemens Aktiengesellschaft

Curamic Electronics Gmbh

Curamix Electronics Gmbh

Laserline Gesellschaft Fur Entwicklung Und Vertrieb Von Diddenlasern Gmbh

Jürgen Schulz-Harder

Karl Exel

Andreas Meyer

Karsten Schmidt

Ernst Hammel

Bernd Medick

Veronika Bauer-Schulz-Harder

Peter Haberl

Volker Krause

Alexander Rogg

Kai Kriegel

Christoph Ullmann

Heiko Schweiger

Lothar Kugler

Erich Ernstberger

Guy Lefranc

Christoph Wehe

Kenneth L Credle, Jr

Andreas Karl Frischmann

Johann Bräutigam

A metal-ceramic substrate having at least one ceramic layer (), which is provided on a first surface side () with at least one first metallization () and on a second surface side (), opposite from the first surface side (), with a second metallization (), wherein the first metallization () is formed by a film or layer of copper or a copper alloy and is connected to the first surface side () of the ceramic layer () with the aid of a 'direct copper bonding' process. The second metallization () is formed by a layer of aluminum or an aluminum alloy.

Metal-ceramic substrate

A package for holding metal-ceramic substrates, the package includes a tray manufactured from a flat material with at least one holder adapted to a format of the metal-ceramic substrates for holding the metal-ceramic substrates, an interior of the at least one holder of the tray being defined by a bottom and circumferentially by an edge and by at least one covering completely accommodating the tray, and the tray is sealed vacuum-tight by the covering and the covering has an interior accommodating the tray, and the tray is impinged with a vacuum so that the metal-ceramic substrates are fixed in the at least one holder by clamping on an edge-side of the tray by forces (F) exerted on the edge resulting from the ambient pressure.

Package for metal-ceramic substrate and method for packing such substrates

A metal-ceramic substrate for electrical circuits or modules includes at least one first outer metal layer forming one first surface side of the metal-ceramic substrate and at least one second outer metal layer forming one second surface side of the metal-ceramic substrate. The outer metal layers are bonded respectively by two-dimensional bonding with the surface sides of a plate-like substrate body.

Metal-ceramic substrate and method for manufacturing such a substrate

An electric device with an insulating substrate consisting of an insulating layer and at least one metallization on a surface side of the insulating layer, the metallization being structured and having an electric component on the metallization. The metallization has a layer thickness that is stepped and is greater in an area adjoining the component.

Electronic device

Disclosed is a method for producing a metal-ceramic substrate. According to said method, a metal layer is applied to at least one face of a ceramic substrate or a ceramic layer by means of a direct bonding process, and the metal-ceramic substrate or partial substrate is aftertreated in a subsequent step at a gas pressure (aftertreatment pressure) ranging approximately between 400 and 2000 bar and an aftertreatment temperature ranging approximately.

Method for the production of a metal-ceramic substrate

The invention relates to a novel process for producing a metal ceramic substrate, especially a copper-ceramic substrate, in which at least one metal foil at a time is applied to the surface sides of a ceramic layer or a ceramic substrate using a high temperature bonding process and the metal foil is structured on at least one surface side for forming conductive tracks, contact surfaces, and the like.

Method for the production of a metal-ceramic substrate, preferably a copper ceramic substrate

A heat sink for cooling parts, subassemblies, modules, or similar components, for cooling electrical or electronic components. The heat sink includes at least one cooling element which forms at least one cooling area for connecting the component that is to be cooled and which is made of a metallic material in the cooling area.

Heat sink and assembly or module unit

The invention relates to a method for producing Peltier modules, each of which comprises several Peltier elements that are arranged between at least two substrates. The substrates are made of an electrically insulating material at least on the sides facing the Peltier elements while being provided with contact areas on said surfaces. The contact areas, to which the Peltier elements are connected by means of terminal sure during the production process, are formed by metallic areas.

Process for producing Peltier modules, and Peltier module

In the case of a metal-ceramic substrate with a multilayered ceramic material in sheet form, and with at least one metallization that is provided on one surface side of the ceramic material and is joined to be ceramic material by direct bonding or active soldering, the ceramic material has at least one inner layer or base layer of a silicon nitride ceramic. The surface side of the ceramic material that is provided with the at least one metallization is formed by an intermediate layer of an oxidic ceramic applied to the base layer.

A method is disclosed for producing metal-ceramic substrates that are metallized on both sides by using the direct bonding process. According to the method, at least one DCB stack made from first and a second metal layer and a ceramic layer located between said metal layers is formed on a separating layer of a support by heating to a direct bonding temperature. At least one of the metal layers rests against the separating layer during the bonding process, said separating layer being composed of a porous layer or coating made of a separating layer material from the group comprising mullite, AlO, TiO, ZrO, MgO, CaO CaCOor a mixture of at least two of said materials.

Method for the production of a metal-ceramic substrate or copper-ceramic substrate, and support to be used in said method

The invention relates to a diode laser array with at least one laser bar and having at least one emitter and a heat sink array for cooling the at least one laser bar.

Diode laser array and method for manufacturing such an array

A method for manufacturing a metal-ceramic substrate with at least one metallization, patterned by etching, on at least one surface side of a laminar ceramic material. The metal-ceramic substrate includes a base substrate made of an aluminum-nitride or silicon-nitride ceramic. The metallization is applied by active soldering before patterning. An intermediate layer made of an oxidic ceramic is provided between the at least one metallization and the base substrate.

Method for manufacturing a metal-ceramic substrate

A method for manufacturing plate stacks for the production of coolers, cooler elements or heat sinks made of at least one plate stack for cooling electric or opto-electric components. The process includes the manufacture of plates or boards of metal, stacking the plates to form a plate stack, joining of the plates with the application of heat and pressure to form a stack, and post-treatment of the plate stack.

Method for manufacturing plate stacks, particularly coolers or cooler elements consisting of plate stacks

The invention relates to a metal-ceramic substrate for electric circuits or modules, the substrate including a ceramic layer which is provided with at least one metallic layer of a first type applied to a surface of the ceramic layer in a plane manner. An insulating layer made up of a glass-containing material is applied to at least one partial region of a surface of the metallic layer of the first type, the surface opposing the ceramic layer, and a metallic layer of a second type is applied to the insulating layer, the insulating layer and the metallic layer of a second type respectively being thinner then the ceramic layer and the metallic layer of the first type.

Growing community of inventors

Lauf, Germany

Jürgen Schulz-Harder