Atotech Deutschland Gmbh

Jörg Schulze

Heiko Brunner

Andreas Kirbs

Michael Merschky

Christian Lowinski

Torsten Voss

Johannes Etzkorn

Birgit Beck

Frank Brüning

Kilian Klaeden

Sebastian Reiber

Elisa Langhammer

Kuldip Johal

Holger Kühnlein

Ulrike Engelhardt

Aylin Sönmez

Torsten Voß

Bernd Fröse

The present invention relates to a method for reducing the optical reflectivity of a copper and copper alloy circuitry wherein a thin palladium or palladium alloy layer is deposited by immersion-type plating onto said copper or copper alloy. Thereby, a dull greyish or greyish black or black layer is obtained and the optical reflectivity of said copper or copper alloy circuitry is reduced. The method according to the present invention is particularly suitable in the manufacture of image display devices, touch screen devices and related electronic components.

Method for reducing the optical reflectivity of a copper and copper alloy circuitry and touch screen device

The invention relates to an electroless aqueous copper plating solution, comprising: a source of copper ions, a reducing agent or a source of a reducing agent, and a combination of complexing agents comprising i) polyamino disuccinic acid, polyamino monosuccinic acid, or a combination thereof, and ii) one or more of ethylenediamine tetraacetic acid, N'-(2-Hydroxyethyl)-ethylenediamine-N,N,N&#x2032;-triacetic acid, and N,N,N&#x2032;,N&#x2032;-Tetrakis (2-hydroxypropyl)ethylenediamine, as well as methods for electroless copper plating utilizing the solution and uses of the solution for the plating of various substrates.

Electroless copper plating solution

To be able to form a copper-zinc-tin alloy which optionally comprises at least one chalcogenide and thus forms a semiconductor without the use of toxic substances a metal plating composition for the deposition of a copper-zinc-tin alloy is disclosed, wherein said metal plating composition comprises at least one copper plating species, at lease one zinc plating species, at least one tin plating species and at least one complexing agent and further, if the alloy contains at least one chalcogen, at least one chalcogen plating species.

Metal plating composition and method for the deposition of copper&#x2014;zinc&#x2014;tin suitable for manufacturing thin film solar cell

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Oranienburg, Germany

Jörg Schulze