Suss Microtec Test Systems Gmbh

Other

Cascade Microtech, Inc.

Jörg Kiesewetter

Stojan Kanev

Claus Dietrich

Stefan Kreissig

Frank Fehrmann

Michael Teich

Karsten Stoll

Axel Schmidt

Stefan Schneidewind

Jens Fiedler

Hans-Jürgen Fleischer

The invention relates to a method for testing several electronic components () of a repetitive pattern under defined thermal conditions in a prober, which comprises a chuck () for holding the components () and special holding devices () for holding individual probes (). For testing, the components () are adjusted to a defined temperature, the probes () and a first electronic component () are positioned relative to each other by means of at least one positioning device, contact pads () of the electronic component () are subsequently contacted by the probes () so that the component () can be tested and then the positioning and the contacting can be repeated for testing another component () of the repetitive pattern. In order to shorten the test time for measurements at changing temperatures while ensuring reliable contacting of the components by using individual probes, a component () is positioned and contacted by a first positioning step which jointly affects all probes () first being carried out in an intermediate position, in the result of which the component () lies at a defined distance under the probe tips (), the position of each individual probe tip () being subsequently corrected by means of separate manipulators to the position of the corresponding contact pad () to be contacted with the particular probe tip () so that each probe tip () lies above a contact pad (), and the probe tips () further subsequently being brought into contact with the contact pads () of the component () by means of an advancing movement.

Method for testing electronic components of a repetitive pattern under defined thermal conditions

A chuck with triaxial construction comprises a receiving surface for a test substrate and arranged below the receiving surface: an electrically conductive first surface element, an electrically conductive second surface element electrically insulated therefrom, and an electrically conductive third surface element electrically insulated therefrom, and, between the first and the second surface element, a first insulation element and, between the second and the third surface element, a second insulation element. A chuck for very low current measurements which can be used to prevent the occurrence of leakage currents and a triboelectric charge and which is configured favourably in terms of production, is achieved because at least one of the electrically conductive surface elements is mechanically connected to at least one insulation element and has an elasticity that compensates for an expansion difference resulting from differences in different coefficients of expansion between a respective surface element and an adjoining insulation element.

Chuck with triaxial construction

A method and an apparatus are provided which make it possible, when testing chips arranged on a wafer, to be able to test optionally both additional components arranged on horizontal boundary lines and on vertical boundary lines. The additional components arranged on horizontal boundary lines are tested in a first position of the wafer. For testing the additional components arranged on vertical boundary lines, the wafer is rotated about its vertical axis through 90&#xb0; relative to the first position into a second position. The apparatus comprises a housing and, in the housing, at least one test probe for making contact with an electronic component, a chuck for moving the wafer and a rotatably mounted additional plate operatively connected to the chuck.

Method and apparatus for testing electronic components within horizontal and vertical boundary lines of a wafer

A prober is described that is suitable for testing of semiconductor substrates under atmospheric conditions that deviate from ambient conditions. The prober includes a chuck for mounting of a semiconductor substrate and a probe holder for mounting of test tips for electrical contacting of the semiconductor substrate. The semiconductor substrate and test tips are arranged within a housing sealed relative to the surrounding atmosphere. The housing comprises two housing parts joined with a seal. The seal can be inflated with two different pressures and is less deformable at higher pressure. For testing of the semiconductor substrate, coarse positioning of the semiconductor substrate relative to the test tips occurs under atmospheric conditions and then fine positioning with the sealed housing and deformable seal before the lower deformability of the seal is produced at higher pressure in the seal and the semiconductor substrate is contacted by the test tips and tested.

Probe station and method for measurements of semiconductor devices under defined atmosphere

A method of contacting a contact area with the tip of a contact needle (contact tip) in a prober and the arrangement of such a prober, is based on the object of ensuring reliable contacting and direct observation of the establishment of the contact between the contact tip and the contact area when contacting contact pads of small dimensions. The prober substantially includes a base frame with a movement device including a clamping fixture for receiving a semiconductor wafer and also contact needles, which are arranged opposite the free surface of the semiconductor wafer. The contacting of the contact tips initially requires a horizontal positioning of the semiconductor wafer, so that the contact area and the contact tip are one above the other and at a distance from each other, and subsequently moving vertically in the direction of the contact tip, until a contact of the contact tips with the contact area is established. The object is achieved by the vertical movement of the semiconductor wafer until the end position is reached being directly observed in a horizontal direction of observation and, for this purpose, an observation device is arranged in such a way that the observation axis runs in the spacing above the free wafer surface.

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Thiendorf OT Sacka, Germany

Jörg Kiesewetter