Toyota Jidosha Kabushiki Kaisha

Jyunya Murai

Daiki Kuboyama

Akira Kato

Hiroshi Yanagimoto

Hiroki Nishijima

Rentaro Mori

Kenji Nakamura

Haruki Kondoh

Kazuaki Okamoto

Keiji Kuroda

Kazuyuki Kuwano

Tomoya Okazaki

Miwako Shionoya

The present disclosure provides a conductive ink or a conductive paste having highly conductive property and excellent low-temperature sinterability. One aspect of the present disclosure relates to a conductive ink or a conductive paste containing metal nanoparticles, a water or a hydrophilic solvent having a vapor pressure of 10 hPa or more, and an additive solvent. A distance Ra between a Hansen solubility parameter of the metal nanoparticles and a Hansen solubility parameter of the additive solvent is in a range of from 2.5 to 13. A distance Rb between a Hansen solubility parameter of the water or the hydrophilic solvent and the Hansen solubility parameter of the additive solvent is 35 or less. Another aspect of the present disclosure relates to a method for producing the conductive ink or the conductive paste, and a method for selecting the additive solvent contained in the conductive ink or the conductive paste.

Conductive ink or conductive paste, and method for producing the same

The present disclosure provides a radio wave transmissive metallic member having an excellent metallic luster. The present disclosure relates to a metallic member and a method for manufacturing the same. The metallic member comprises a substrate body, an ion-exchange resin layer formed on the substrate body, and a metal particle layer formed on the ion-exchange resin layer, wherein metal particles having a high aspect ratio are longitudinally oriented with respect to the ion-exchange resin layer and the substrate body.

Radio wave transmissive metallic member and method for manufacturing the same

First, a patterned substrate including an insulating substrate, a conductive seed layer, and an insulating layer is prepared. The seed layer is disposed on the insulating substrate, and consists of a first part having a predetermined pattern corresponding to the wiring pattern and a second part as a part other than the first part. The insulating layer is disposed on the second part of the seed layer. Subsequently, a metal layer having a thickness larger than a thickness of the insulating layer is formed on the first part of the seed layer. Here, a voltage is applied between an anode and the seed layer while a resin film containing a metal ion-containing solution is disposed between the patterned substrate and the anode and the resin film and the seed layer are brought into pressure contact. Subsequently, the insulating layer and the second part of the seed layer are removed.

Method for manufacturing wiring board

Composite particles sinterable at a low temperature and allow forming a sintered body that exhibits a large extension are provided. The composite particles include microparticles having an average crystallite diameter of 0.6 to 10 &#x3bc;m and containing a metal, and nanoparticles adhered to a surface of the microparticle, having an average crystallite diameter of 3 to 100 nm, and containing a metal of a same kind as the metal contained in the microparticle.

Composite particles and method for producing composite particles

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Toyota, Japan

Jyunya Murai