Hitachi Chemical Company, Ltd.

Jyunichi Koide

Isao Tsukagoshi

Kouji Kobayashi

Naoki Fukushima

Kazuya Matsuda

An apparatus includes a connection sheet having a separator layer and an adhesive film layer formed on the separator layer such that said adhesive film layer can be peeled from the separator layer. The cohesive strength of the adhesive film layer decreases when the adhesive film layer is heated to a predetermined temperature. Electronic parts each have an electrode surface and at least one electrode on the electrode surface. The electrode surface of each of the electronic parts is affixed to the adhesive film layer such that the adhesive film layer coats all exposed portions of the electrode surface and coats all exposed surfaces of the at least one electrode.

Adhesive-coated electronic parts on a connection sheet

An apparatus includes a connection sheet having a separator layer and an adhesive film layer formed on the separator layer such that said adhesive film layer can be peeled from the separator layer. The cohesive strength of the adhesive film layer decreases when the adhesive film layer is heated to a predetermined temperature. Electronic parts each have an electrode surface and at least one electrode on the electrode surface. The electrode surface of each of the electronic parts is affixed to the adhesive film layer such that the adhesive film layer coats all exposed portions of the electrode surface and coats all exposed surfaces of the at least one electrode

Method of mounting a plurality of electronic parts on a circuit board

A method of mounting electronic parts on a circuit board comprises an adhesive layer formation step of forming, on an electrode surface of each electronic part on which electrodes are formed, a film-like thermosetting adhesive layer having an area substantially equal to that of the corresponding electrode surface so as to obtain adhesive-coated electronic parts. The electrodes on which the adhesive layer is formed are arranged so as to face corresponding electrodes of the circuit board, and the electrodes are positioned relative to each other. Heat and pressure are applied to the electrodes of the electronic parts and the electrodes of the circuit board to fix the electrodes to each other after the electrodes are positioned. Almost no adhesive superfluously comes out of the electrode surfaces. Accordingly, when mounting the electronic parts on the circuit board, it is unnecessary to remove superfluous adhesive, unlike conventional process, whereby the efficiency is improved and also the cost can be cut down.

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Ibaragi-ken, Japan

Jyunichi Koide