Powerchip Technology Corporation

Jyun-Da Wu

Chien-Chung Chen

Shih-Tsung Hsiao

Huang-Wen Chen

Sheng-Hsiu Peng

Huang-Wei Wu

A process control method is provided for performing a deposition process on a plurality of wafers of a batch. The process control method includes: deciding a placement location of the wafers of the batch according to the history information of a tool and the product information of the batch; calculating a target value of each placement location according to the placement location of the wafers of the batch and the history information of the tool; calculating a process parameter according to the history information of the tool, the product information of the batch, and the target value of each placement location; and performing a deposition process according to the placement location of the wafers of the batch and the process parameter.

Process control method and process control system

A dispatch control method for a furnace process including the following steps is provided. Before a plurality of lots of wafers is loaded into a furnace, the characteristic variation value of each of the plurality of lots of wafers is calculated. The plurality of lots of wafers is ordered according to the size of the characteristic variation values. The plurality of lots of wafers is placed in the furnace in a descending order of the characteristic variation values corresponding to a plurality of locations in the furnace causing the characteristic variation values to change from smaller to larger.

Growing community of inventors

Taoyuan County, Taiwan

Jyun-Da Wu