Taiyo Yuden Co., Ltd.

Jyouji Ariga

Norihiro Arai

Takeshi Nosaki

Masumi Ishii

Yasushi Inoue

Katsuo Sakatsume

Hiroyuki Moteki

Manabu Ozawa

Kazuya Maekawa

A multi-layer ceramic capacitor includes: a ceramic body including ceramic layers laminated along one axial direction, first and second internal electrodes alternately disposed between the ceramic layers, first and second end surfaces to which the first and second internal electrodes are respectively drawn, a first end margin that forms an interval between the first end surface and the second internal electrodes, and a second end margin that forms an interval between the second end surface and the first internal electrodes; and first and second external electrodes that respectively cover the first and second end surfaces and are respectively connected to the first and second internal electrodes, the multi-layer ceramic capacitor satisfying the following relationship: S&#x2265;S/400+300, where S (&#x3bc;m) represents an area of the ceramic body and S(&#x3bc;m) represents a total area of the first and second internal electrodes in cross sections of the first and second end margins.

Multi-layer ceramic capacitor

A method of manufacturing a multilayer ceramic capacitor includes: forming a multilayer body by alternately stacking a green sheet and a conductive paste for forming an internal electrode layer, the green sheet being mainly composed of a ceramic material having a perovskite structure that includes Ca and Zr and is expressed by a general expression ABOand containing an alkali metal, the conductive paste being mainly composed of Cu, containing a ceramic co-material and no alkali metal; and baking the multilayer body to obtain a ceramic multilayer body.

Method of manufacturing multilayer ceramic capacitor and multilayer ceramic capacitor

A ceramic electronic device includes: a multilayer chip having a first and a second internal electrode layers; a first and a second external electrodes covering a first a second regions of a surface of the multilayer chip, wherein: a mark is shifted on a side of one of two end faces on an upper face; the first internal electrode layer is exposed to the first region and connected to the first external electrode; the second internal electrode layer is exposed to the second region and connected to the second external electrode; the second internal electrode is shifted further on a side of the lower face than on a side of the upper face; the second internal electrode layer is shifted further on a side of the lower face than the upper face; the second region is a region of a half of the surface on the lower face side.

Multilayer ceramic capacitor, package of multilayer ceramic capacitor and component mounting circuit substrate

A multilayer ceramic capacitor includes: a ceramic multilayer structure designated to have ceramic dielectric layers and internal electrode layers alternately stacked, the internal electrode layers being mainly composed of a transition metal other than an iron group, end edges of the internal electrode layers being alternately exposed to a first end face and a second end face; and a pair of external electrodes provided on the first end face and the second end face, wherein: the external electrodes have a base conductive layer and a first plated layer; the base conductive layer directly contacts the ceramic multilayer structure; a main component of the base conductive layer is a noble metal or a transition metal other than an iron group; and a total concentration of Si and B in a second-phase not contacting the ceramic multilayer structure is 0.3 wt % or less, in the base conductive layer.

Multilayer ceramic capacitor

A multilayer ceramic capacitor includes: a ceramic multilayer structure having ceramic dielectric layers and internal electrode layers alternately stacked, the internal electrode layers being mainly composed of a transition metal other than an iron group, end edges of the internal electrode layers being alternately exposed to a first end face and a second end face; and a pair of external electrodes provided on the first end face and the second end face, wherein the external electrode includes a base conductive layer that includes glass of less than 7 weight % and is mainly composed of a transition metal other than an iron group or a noble metal, and a first plated film that covers the base conductive layer, has a thickness that is half of a thickness of the base conductive layer or more and is mainly composed of a transition metal other than an iron group.

Multilayer ceramic capacitor and manufacturing method of multilayer ceramic capacitor

A multi-layer ceramic electronic component includes a multi-layer unit and an external electrode. The multi-layer unit includes an end surface oriented in a first direction, a side surface oriented in a second direction orthogonal to the first direction, a ridge connecting the end surface and the side surface, ceramic layers, and internal electrodes. The multi-layer ceramic electronic component satisfies the following relationships: A/L&#x2265;0.0142*ln(L)+0.0256, A/T&#x2265;0.0274*ln(T)+0.0719, B/L&#x2265;0.0103*ln(L)+0.0281, and B/T&#x2265;0.0189*ln(T)+0.0707, where A represents a thickness of the external electrode in the second direction at a position adjacent to the ridge on the side surface, B represents a thickness of the external electrode in the first direction at a position adjacent to the ridge on the end surface, L represents a dimension of the multi-layer ceramic electronic component in the first direction, and T represents a dimension of the multi-layer ceramic electronic component in the second direction.

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Takasaki, Japan

Jyouji Ariga