International Business Machines Corporation

Jyothi Singh

James Anthony O'Neill

William Francis Landers

Gary S Selwyn

Michael L Passow

Tina J Cotler

Richard Anthony Conti

Jonathan Daniel Chapple-Sokol

George G Gifford

Kurt L Haller

Reid S Bennett

Albert R Ellingboe

John S McKillop

John C Forster

John H Keller

Lawrence Andrew Kropp

A method and apparatus for detecting scratches on a wafer surface. The method comprises the use of a monitor wafer which has a substrate, a first layer deposited on the substrate, and a second layer deposited on the first layer. The first and second layers have contrasting work functions such that when short wavelength light is directed on the monitor wafer, scratches through the second layer can be detected.

Apparatus for mapping scratches in an oxide film

Method for mapping scratches in an oxide film

A system and method of measurement of emissivity and radiance of a wafer in a rapid thermal processing chamber enables determination of wafer temperature and control of temperature of the wafer. Mirrors enclose the chamber and reflect radiation from lamps within the chamber to heat the workpiece of interest. One or more viewing ports are provided in one of the mirrors to allow for the egress of radiant energy emitted by the wafer. The wavelength of the exiting radiation is selected by an optical filter having a passband which passes radiation at wavelengths emitted by the wafer while excluding radiation emitted by heating lamps. A chopper having surface regions differing in their reflectivity and transmissivity is positioned along an optical path of radiation propagating through the one or more ports, this resulting in a pulsation of detected radiation. The ratio of the detected intensities of the radiation pulses is used to determine wafer reflectance based on reflectivity and transmissivity of the reflective portion of the chopper. The maximum intensity of radiation is also taken as a measure of radiance. The reflectance is employed to calculate the emissivity, and the emissivity in combination with the radiance are employed to calculate the wafer temperature.

Combined emissivity and radiance measurement for determination of

A method for imaging surface topography is based on Total Internal Reflection (TIR) and is particularly useful for imaging surface topography of wafers used in the manufacture of integrated circuits. This surface topography includes scratches, which are more localized, and dishing, which is a gentle dip over a larger area. In practice, a wafer is placed with the surface of interest in close contact with a prism or other internal reflection element (IRE). Light of suitable wavelength is incident at a suitable incident angle through the IRE of suitable refractive index in order to allow total internal reflectance at the surface of the IRE in close contact with the wafer surface. The reflected beam is then imaged to give a map of the location and dimensions, and some information on the depth, of the various surface features on the wafer.

Method and apparatus for imaging surface topography of a wafer

Selective etching of separate materials in a manufacture of a device, such as a layer of silicon dioxide on a substrate of silicon in a semiconductor device, is accomplished in a reaction chamber having an RF electromagnetic field which interacts with plural etchants in gaseous phase to produce ions for etching the materials. The ratio of the concentration of etchants affect the relative rates of etching the respective materials. By pulsing the rf excitation waveform, intervals of deenergization of the field are produced repetitively wherein, during any one of these intervals, there is a decay in the concentration of each ionized etchant. Rates of decay and the resulting lifetimes differ for each of the etchants. Thereby, by adjustment of the duration of the deenergization interval, the average concentration of one etchant relative to the average concentration of a second etchant can be varied to attain selective etching of the materials. Continuous monitoring of etchant concentrations, as by ultraviolet absorption spectroscopy, permits automatic control of the modulation to attain a desired etch selectivity in real time.

Control of etch selectivity

Combined emissivity and radiance measurement for the determination of

An apparatus for processing a layer on a workpiece includes a source of reactant fluid, a reaction chamber having a support for the workpiece and a fluid delivery apparatus for feeding an input fluid into the reaction chamber with the input fluid being utilized to process the material. An infrared sensor is adapted to cooperate with the fluid delivery apparatus for sensing the concentration of a component of the input fluid. The infrared sensor includes an infrared light source positioned to direct a beam of infrared light at an infrared light detector through the input fluid. The infrared light detector produces an electrical output signal indicative of the amount of light received by the detector and therefore not absorbed by the input fluid.

Fluid delivery apparatus having an infrared feedline sensor

Fluid delivery apparatus and method having an infrared feedline sensor

Contamination levels in plasma processes are reduced during plasma processing, by prevention of formation of particles, by preventing entry of particles externally introduced or by removing particles spontaneously formed from chemical and/or mechanical sources. Some techniques for prevention of formation of particles include interruption of the plasma by pulsing the source of plasma energy periodically, or application of energy to provide mechanical agitation such as mechanical shockwaves, acoustic stress, ultrasonic stress, vibrational stress, thermal stress, and pressure stress. Following a period of applied stress, a tool is pumped out (if a plasma is used, the glow is first discontinued), vented, opened and flaked or particulate material is cleaned from the lower electrode and other surfaces. A burst of filtered air or nitrogen, or a vacuum cleaner is used for removal of deposition debris while the vented tool is open. Following this procedure, the tool is then be used for product runs. Alternatively, improvement of semiconductor process yields can be achieved by addition of reagents to getter chemical precursors of contamination particulates and by filtration of particulates from feedgas before plasma processing. The efficiency and endpoint for the applied stress are determined, by laser light scattering, using a pulsed or continuous laser source, e.g. a HeNe laser.

Methods and apparatus for contamination control in plasma processing

A non-intrusive means and method are disclosed for monitoring the interelectrode gap in a reaction chamber containing a pair of variably spaced, nominally parallel reaction-sustaining electrodes. An example is given in which the chamber is a plasma enhanced chemical vapor deposition chamber. The electrodes are treated as a parallel plate capacitor in order to measure the gap therebetween as well as the parallelism of the electrodes without requiring that the chamber be opened. A calibration curve is prepared by ascertaining known values of gaps by use of spacer gauges and then measuring and storing the corresponding values of the gaps and the capacitances. Once the calibration curve is established and stored, the spacing between the electrodes can be checked from time to time, as needed, without opening the chamber. It is only necessary to measure the capacitance existing and then refer the measured value to the stored values to read out the corresponding gap value. By making several capacitance measurements, a new curve can be made from time to time which can be compared as to slope with the stored calibration curve to check the parallelism of the electrodes.

Reaction chamber interelectrode gap monitoring by capacitance measurement

Contamination levels in plasma processes are reduced during plasma processing, by prevention of formation of particles, by preventing entry of particles externally introduced or by removing particles spontaneously formed from chemical and/or mechanical sources. Some techniques for prevention of formation of particles include interruption of the plasma by pulsing the source of plasma energy periodically, or application of energy to provide mechanical agitation such as mechanical shockwaves, acoustic stress, ultrasonic stress, vibrational stress, thermal stress, and pressure stress. Following a period of applied stress, a tool is pumped out (if a plasma is used, the glow is first discontinued), vented, opened and flaked or particulate material is cleaned from the lower electrode and other surfaces. A burst of filtered air or nitrogen, or a vacuum cleaner is used for removal of deposition debris while the vented tool is open.

An apparatus and method for determining the time at which a plasma etching process should be terminated. The process generates at least one etch product species and a continuum plasma emission. The apparatus monitors the optical emission intensity of the plasma in a narrow band centered about a predetermined spectral line and generates a first signal indicative of the spectral intensity of the etch product species. The apparatus further monitors the optical emission intensity of the plasma in a wide band and generates a second signal indicative of the spectral intensity of the continuum plasma emission. The apparatus further monitors the magnitudes of the first and second signals and generates a termination signal when the magnitudes diverge.

Method and apparatus for optical emission end point detection in plasma

A plasma processing apparatus and process endpoint detection method including a plasma chamber for processing an item that has a first portion of a first material and a second portion of a second material, with the first and second materials having different work functions, and a structure for generating a plasma in the plasma chamber, with the plasma generating structure including at least a pair of RF-power electrodes with one of them being excited by an RF excitation frequency. The apparatus further includes a structure for generating and ejecting electrons from the second material only when the second material is exposed to the plasma, and a structure for increasing the energies of these generated electrons and accelerating these electrons into the etching plasma with sufficient energy to generate secondary electrons in the plasma. The apparatus further includes a structure for receiving a plasma discharge voltage signal, a structure for filtering the discharge electrical voltage signal to remove the RF excitation frequency and any DC components therein, and a structure for amplifying the natural frequencies of excitation and decay of the plasma discharge voltage perturbation signal, to thereby detect the processing endpoint. In a preferred embodiment, the electron energy increasing and accelerating structure includes a structure for generating an electrode voltage sheath, and a structure for generating the electrons within this voltage sheath to thereby accelerate the electrons into the plasma. The electron generating structure includes a structure for directing a beam of photons in a selected energy range onto the item to be processed, which energy range is not sufficient to eject photoelectrons from the first material, but is high enough to generate photoelectrons from areas of exposed second material.

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Hopewell Junction, NY, United States of America

Jyothi Singh