Industrial Technology Research Institute

Jyh-Long Jeng

Jeng-Yu Tsai

Wei-Ta Yang

Shur-Fen Liu

Jinn-Shing King

Dar-Ming Chiang

Chih-Ming Hu

Jyi-Tyan Yeh

Charng-Shing Lu

Chen-Hsi Cheng

Yen-Yi Chu

Chun-Ti Chen

You-Chia Chang

Chi-En Kuan

Yi-Syuan Wang

An anhydride compound, polyimide, and thin film are provided. The anhydride compound has a chemical structure of wherein Ris each of Ris independently Calkylene group, m is an integer of 0 to 10, and m' is an integer of 1 to 10; n is an integer of 1 to 10, each of Ris independently hydrogen, saturated or unsaturated Chydrocarbon group, CF, silanol group, silyl group, or Al(OH); and Ris silanol group, silyl group, or Al(OH). The anhydride compound can be reacted with a diamine compound to form a polyimide.

Anhydride compound, polyimide, and thin film

A compound, a resin composition and a laminated substrate thereof are provided. The compound has a structure represented by Formula (I) wherein Ais Calkylene group, Calkenylene group, Calkynylene group, Calicyclic alkylene group, Calicyclic alkenylene group, or Calicyclic alkynylene group. Ais Calkylene group, C-Carylene group with two reactive groups, Ccycloalkylene group, Cheteroarylene group, divalent C-Calkylaryl group, divalent Cacylaryl group, divalent Caryl ether group, or divalent Cacyloxyaryl group; and, n&#x2265;1.

Compound, resin composition and laminated substrate thereof

A composition, an insulating material, and a method for preparing an insulating material are provided. The composition includes (a) 100 parts by weight of oligomer of Formula (I) (b) 20-50 parts by weight of polymer having at least two reactive functional groups, wherein the reactive functional group is a reactive-double-bond-containing functional group; (c) 1-5 parts by weight of photoinitiator; (d) 0.5-2 parts by weight of thermal initiator; and (e) 0.5-2 parts by weight of photoacid generator.

Composition, insulating material, and method for preparing an insulating material

A solventless resin composition with a low dielectric constant and a substrate structure are provided. The composition includes: (a) 20-50 parts by weight of a copolymer having the structure of Formula (I)  (c) 80-100 parts by weight of a hardener; and (d) 70-100 parts by weight of an inorganic filler.

Low dielectric constant and solventless resin composition and substrate structure

A polymer, a method for preparing the same, and a photosensitive resin composition thereof are provided. The polymer has a structure represented by Formula (I): wherein Ris &#x2014;OH, or &#x2014;COOH; Ais each Ais independently each Ais independently Z is &#x2014;O&#x2014;, &#x2014;S&#x2014;, &#x2014;C(CH3)2-, &#x2014;C(CF3)2-, m is a positive integer that is greater than 1; n is a positive integer that is greater than 1; i is a positive integer between 1 and 3; and, j is a positive integer between 1 and 20; and, the repeat units are arranged in a random fashion.

Polymer, method for preparing the same, and a photosensitive resin composition thereof

A transparent speaker is suitable for being disposed on a display panel. The transparent speaker includes a transparent membrane, a transparent electrode plate, and spacers. Each transparent electrode plate has a plurality of openings. The display panel includes a plurality of pixels. The pixels emit optical signals. A Moire spatial period of the optical signals is less than 600 &#x3bc;m after the optical signals pass through the transparent speaker. When the transparent speaker is disposed on the display panel, a user is able to watch an image on the display panel through the transparent speaker without being interfered by a Moire.

Transparent speaker and display module integrating the same

The present invention is directed to a negative photoresist composition which mainly is composed of a) a polyimide having pendant carboxyl groups, wherein a portion of the carboxyl groups reacted with glycidyl (meth)acrylate monomers to form covalent bonds. The photoresist composition further contains b) monomers having a tertiary amino group and a C&#x2550;C double bond, which form ionic bonds with the remaining hydroxyl groups of the polyimide. The photoresist composition further contains c) a photoinitiator which is also called photosensitizer. The components a) to c) are all dissolved in a solvent.

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Taipei, Taiwan

Jyh-Long Jeng