Snaptrack Incorporated

Epcos Ag

Tdk Corporation

Jürgen Portmann

Wolfgang Pahl

Alois Stelzl

Christian Bauer

Hans Krüger

Hans Krueger

Anton Leidl

Karl Nicolaus

Christian Hoffmann

Karl Weidner

Pirmin Hermann Otto Rombach

Thomas Metzger

Jan Tue Ravnkilde

Gregor Feiertag

Kurt Rasmussen

Marcel Giesen

Armin Schober

Morten Ginnerup

Claus Reitlinger

Christian Siegel

Stefan Kiefl

Oliver Freudenberg

Andreas Franz

Robert Eichinger

Thomas Wassner

Thomas Sedlmeier

Hans KRÜGER

The invention relates to a simple to produce electric component for chips with sensitive component structures. Said component comprises a connection structure and a switching structure on the underside of the chip and a support substrate with at least one polymer layer.

Electric component with sensitive component structures and method for producing an electric component with sensitive component structures

The present invention relates to a module that has a lower component of a module () having a material () in which at least one first structural element () is embedded, and an upper component of a module () having a material () in which at least a second component () is embedded. The upper component of the module () and the lower component of the module () are stacked, with the lower and the upper component of the module () being electrically connected and mechanically linked to each other. In addition, the present invention relates to a simple and cost-effective process for the production of a variety of modules. The invention makes it possible for the modules to be miniaturized with respect to surface and height and/or makes it possible to achieve greater integration by 3D packaging.

Stacked modules

A MEMS component having increased integration density and a method for manufacturing such a component are specified. The component comprises a base wafer and a cover wafer arranged over this. A first cavity is arranged between the base wafer and the cover wafer. A second cavity is arranged over the cover wafer, below a thin-layer covering. The cavities contain component structures.

MEMS component having a high integration density

A MEMS component includes, on a substrate, component structures, contact areas connected to the component structures, metallic column structures seated on the contact areas, and metallic frame structures surrounding the component structures. A cured resist layer is seated on frame structure and column structures such that a cavity is enclosed between substrate, frame structure and resist layer. A structured metallization is provided directly on the resist layer or on a carrier layer seated on the resist layer. The structured metallization includes at least external contacts of the component and being electrically conductively connected both to metallic structures and to the contact areas of the component structures.

MEMS component and method for encapsulating MEMS components

The invention relates to a cased electrical component comprising a carrier substrate (), a spring device (), which is arranged on the carrier substrate (), a chip (), which on a first side () of the chip is coupled to the spring device (), and a cover element (), which is arranged on the carrier substrate (). The cover element () is arranged over the chip () such that the cover element () is in contact with the chip () at least on a second side () of the chip, which is different from the first side. The component has a low space requirement and is highly sealed with respect to influences from the surroundings.

Method for producing a cased electrical component

A top-port MEMS-microphone has an upper side and a bottom side. The microphone includes a MEMS chip with a monolithically connected protection element at the upper side, a backplate, and a membrane. The microphone also includes a sound inlet at the upper side and a mechanical or electrical connection at the bottom side.

Top-port MEMS microphone and method of manufacturing the same

Cased electrical component

The present invention relates to a method for producing a sensor (SEN), comprising the steps of arranging a sensor element (SE) on a carrier (TR), arranging a cover (AF) on the sensor element (SE), wherein the sensor element (SE) is enclosed between the cover (AF) and the carrier (TR), adhesively bonding a carrier film (TF) onto the cover (AF), and producing an opening (SO) in the carrier film (TF) and the cover (AF), wherein the openings (SO) in the carrier film (TF) and the cover (AF) at least partly overlap.

Method for producing a sensor

The invention relates to a component and a method for producing said component. The component comprises a substrate (S), a chip (CH), a frame (MF), which is connected to the substrate (S) and on which the chip (CH) bears. A metallic closure layer (ML) encompasses the frame (MF), the substrate (S) and the chip (CH) such that a volume enclosed by the substrate (S), the chip (CH) and the frame (MF) is hermetically sealed.

Encapsulation of an MEMS component and a method for producing said component

The present invention relates to an encapsulated component that includes a carrier substrate and at least one chip positioned on the top of the carrier substrate and electrically connected to it by means of electrically conductive connections. The encapsulation of the chip is accomplished with a seal or dielectric layer. As a result of differing coefficients of expansion of the seal or dielectric layer and the electrically conductive connections, with changing temperatures stresses occur in the electrically conductive connections, which can lead to cracks, breaks and even to interruption of the electrically conductive connections. To mechanically relieve the electrically conductive connections of stresses from changing temperatures (in particular under extreme thermal loads), it is proposed that the carrier substrate be provided with a support element that encircles the chip, which serves to support the seal or dielectric layer, and/or that the material and the arrangement of the encapsulation be selected accordingly.

Encapsulated electronic component and production method

For simpler and safer encapsulation of components, it is proposed to generate the connection between a chip and a carrier substrate by means of bump connections that are sunk into recesses on the carrier substrate. The component thereby lies directly on the carrier substrate, in particular on a frame circumscribing the component structures on the chip.

Encapsulated component which is small in terms of height and method for producing the same

Growing community of inventors

Munich, Germany

Jürgen Portmann