Osram Opto Semiconductors Gmbh

Osram Opto Semiconductor Gmbh

Jürgen Dachs

Frank Singer

Thomas Schwarz

Stefan Illek

Ulrich Steegmüller

Roland Enzmann

Wolfgang Gramann

Roland Schulz

Karsten Auen

Mathias Kämpf

Christoph Walter

Tomasz Swietlik

Stephan Haneder

Andreas Rozynski

Markus Graul

Heiko Unold

In a method for producing a laser diode, a number of laser diodes are produced on a wafer. The wafer is broken down into wafer pieces, each wafer piece having a plurality of laser diodes being arranged side by side. One wafer piece is inserted into a first mount that includes a first covering element overlapping a front face of the wafer piece and shadowing a bottom area of the front face of the wafer piece. A minor layer is deposited on an unshadowed upper area of the wafer piece's front face. The wafer piece is inserted into a second mount, which includes a second covering element that shadows the minor layer of the upper area of the front face. An electrically conductive contact layer is deposited on an unshadowed bottom area of the wafer piece's front face. The wafer piece is subsequently broken down into individual laser diodes.

Method for producing a laser diode, mount and laser diode

A component carrier assembly () is provided which has a plurality of component carrier regions (), which are intended for mounting semiconductor components. The component carrier assembly comprises a carrier body () with a first major face (). On the first major face a trench pattern () is formed in the carrier body, with first trenches () extending parallel to one another in a first direction, the first trenches delimiting the component carrier regions in a second direction extending transversely of the trenches. A coating () is formed on the carrier body, such that the component carrier regions each have a first major face of the carrier body which is coated at least in places and a side face () of the trench pattern which is coated at least in places.

Component carrier assembly having a trench structure which separates component carrier regions, and method for producing a plurality of component carrier regions

An optical sensing head, which is for reading out an optical data memory, has a substrate with a main surface. An edge-emitting laser component is configured on the main surface of the substrate and has irradiation axis oriented essentially parallel to the first main plane. A deflection device is arranged on the main surface of the substrate and deflects the laser radiation in a direction that is essentially perpendicular to the main surface. At least one signal detector is provided for sensing the laser radiation that is reflected by the optical data memory. An optical element guides the deflected laser radiation to the optical data memory and guides reflected laser radiation to the signal detector. The optical element is connected to the substrate by at least one supporting element. The invention also includes a method for fabricating such a sensing head.

Optical sensing head and method for fabricating the sensing head

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Baar-Ebenhausen, Germany

Jürgen Dachs