Ev Group E. Thallner Gmbh

Ev Group Gmbh

Jürgen Burggraf

Markus Wimplinger

Friedrich Paul Lindner

Daniel Burgstaller

Harald Wiesbauer

Stefan Pargfrieder

Bernhard Rebhan

Herbert Tiefenböck

Gerald Mittendorfer

Peter-Oliver Hangweier

Christian Perau

Paul Lindner

Apparatus and method for heating a substrate. The apparatus including a heater and a substrate holder with a substrate holder surface, wherein the substrate to be heated can be placed on the substrate holder surface, the apparatus further includes means for exerting forces on the heater, the apparatus further includes a control unit for controlling the means, wherein the heater is deformable by the means.

Apparatus with deformable heater and method for heating a substrate thereof

A method and device for bonding a first substrate to a second substrate at contact surfaces of the substrates. The method includes the following steps: mounting the first substrate on a first mounting surface of a first substrate holder and mounting the second substrate on a second mounting surface of a second substrate holder, wherein the substrate holders are arranged in a chamber;

Device and method for joining substrates

A device and corresponding method for coating of an inner circular surface of a coating surface of a carrier wafer with a coating material. The device includes an application means for applying a coating material intended for coating of the inner circular surface to the inner circular surface, a rotating means for accommodating and rotating the carrier wafer around an axis of rotation and for distribution of the coating material on the coating surface, and a second application means for applying a coating inhibitor to an outer circular ring surface which surrounds the inner circular surface, said coating inhibitor at least inhibits the coating of the outer circular ring surface during the distribution of the coating material.

Device and method for coating of a carrier wafer

A method and a device for determining the pressure distribution for bonding of a first substrate to a second substrate, with the following steps, especially with the following sequence: placing a measurement layer between a first tool for holding the first substrate and an opposite second tool which is aligned to the first tool for bonding of the substrate, deformation of the measurement layer by bringing the tools closer to one another, measurement of the deformation of the measurement layer and computation of the pressure distribution.

Method and device for determining the pressure distribution for bonding

A method for treatment of a product wafer temporarily bonded on a carrier wafer with the following steps: grinding and/or backthinning of the product wafer on one flat side facing away from the carrier wafer to a product wafer thickness D of &#x3c;150 &#x3bc;m, especially &#x3c;100 &#x3bc;m, preferably &#x3c;75 &#x3bc;m, even more preferably &#x3c;50 &#x3bc;m, especially preferably &#x3c;30 &#x3bc;m, surface treatment of the flat side with means for reducing an especially structural intrinsic stress of the product wafer.

Method for treatment of a temporarily bonded product wafer

A flexible carrier mount for mounting of a carrier substrate when the carrier substrate is detached from a product substrate, detachment means being provided for debonding the product substrate with bending of the carrier substrate. A device for detaching a carrier substrate from one product substrate in one detachment direction having: a carrier mount flexible in the detachment direction for mounting the carrier substrate, a substrate mount for mounting the product substrate, and detachment means for debonding the carrier substrate from the product substrate with bending of the carrier substrate. A method for detaching a carrier substrate from a product substrate in one detachment direction with the steps: mounting the product substrate with a substrate mount and mounting the carrier substrate with a carrier mount flexible in the detachment direction and debonding the carrier substrate from the product substrate with bending of the carrier substrate.

Bendable carrier mount, device and method for releasing a carrier substrate

A workholding fixture for holding flat semiconductor substrates with

Receiving device for receiving semiconductor substrates

Device for stripping a product substrate off a carrier substrate connected to the product substrate by an bonding layer by means of a film frame, a flexible film which is connected to the film frame and which has an adhesive layer for holding the product substrate in a contacting surface section of the film, the film being connected to the film frame in an attachment section of the film which surrounds the contacting surface section, as well as a solvent reservoir formed by the film frame and the film, especially of variable volume, for holding the solvent for detaching the bonding layer, and the product substrate and the bonding layer can be accommodated in the solvent reservoir, and by delivery means for delivering the solvent into the solvent reservoir and by stripping means for stripping the product substrate off the carrier substrate.

Device for detaching a product substrate off a carrier substrate

A method for producing a product wafer having chips thereon, comprising the steps of:

Method for producing a wafer provided with chips

A device for aligning and prefixing a flat substrate on a carrier substrate for the further processing of the substrate. The device includes aligning means for aligning a substrate's outside contour relative to a carrier substrate's outside contour by engaging the substrate's outside contour. The alignment of the substrate is carried out along a substrate plane E that is parallel to a contact surface of the substrate. Attaching means is provided for at least partial prefixing of the aligned substrate on the carrier substrate.

Device for aligning and pre-fixing a wafer

Device for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, the device having stripping means for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate. Furthermore, the invention relates to a method for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, and a stripping of the product substrate from the carrier substrate from the periphery of the product substrate being caused by the stripping means.

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Schärding, Austria

Jürgen Burggraf