Dow Silicones Corporation

Dow Toray Co., Ltd.

Juyoung Yook

Nanguo Liu

Zachary Wenzlick

Atsushi Sugie

Gyuyoung Lee

Deokgu Kim

Makoto Yoshitake

Takuya Ogawa

Hojin Choi

Jongchan Park

Yoonyoung Kim

Yungjin Park

A silicone hybrid pressure sensitive adhesive composition that cures to form a silicone hybrid pressure sensitive adhesive contains a polydiorganosiloxane having reactive groups. The reactive groups include a silicon bonded(meth)acryloxyalkyl-functional group in a pendant position and optionally a silicon bonded aliphatically unsaturated hydrocarbon group in a terminal position. The silicone hybrid pressure sensitive adhesive composition can be cured via hydrosilylation reaction on a surface of a substrate to form a protective film. The protective film can be used to protect a passivation layer during a process for fabricating an (opto)electronic device such as a flexible organic light emitting diode display. The protective film can be exposed to radiation to reduce tack and facilitate detaching the protective film from the passivation layer.

Silicone hybrid pressure sensitive adhesive and methods for its preparation and use in protective films for (opto)electronic device fabrication

A photocurable silicone composition is disclosed. A cured product of the composition is also disclosed, as well as methods of forming the same. The photocurable silicone composition comprises: (A) a specific organopolysiloxane having alkenyl groups in a molecule; (B) a compound having at least two thiol groups in a molecule; (C) a photoradical initiator having a phosphorus atom; and (D) a specific hydroxyphenyl triazine compound. The composition exhibits excellent curability by LED lamp with wide UV-Visible range as well as metal-halide lamp, and cures to form a cure product exhibiting excellent resistance to light.

Photocurable silicone composition and cured product thereof

A photocurable silicone composition is disclosed. A cured product of the composition is also disclosed. The photocurable silicone composition comprises: (A) an organopolysiloxane having at least one aryl group with 6 to 12 carbons and at least one alkenyl group with 2 to 12 carbons in a molecule; (B) an organic compound having at least two ether bonds and at least one aliphatic carbon-carbon double bond in a molecule; (C) a thiol group-containing organic compound comprising; (C) an organic compound having two thiol groups in a molecule, and (C) an organic compound having at least three thiol groups in a molecule; and (D) a photoradical initiator. The composition generally suppresses crack and delamination of a cured product laminated between two substrates after thermal aging.

A curable silicone-(meth)acrylate pressure sensitive composition is curable via hydrosilylation reaction to form a silicone-(meth)acrylate pressure sensitive adhesive with an initial adhesion. When the silicone-(meth)acrylate pressure sensitive adhesive is exposed to actinic radiation, the resulting silicone-(meth)acrylate adhesive has a subsequent adhesion, which is higher than the initial adhesion.

Curable silicone-(meth)acrylate composition and methods for its preparation and use

A silicone hybrid pressure sensitive adhesive composition that cures to form a silicone hybrid pressure sensitive adhesive contains a polydiorganosiloxane having reactive groups. The reactive groups include a silicon bonded (meth)acryloxyalkyl-functional group in a pendant position and a silicon bonded aliphatically unsaturated hydrocarbon group. An adhesive article, such as a tape, can be formed by coating the silicone hybrid pressure sensitive adhesive composition on a surface of a substrate and curing said composition via hydrosilylation reaction (B-staged cure) to form a silicone hybrid pressure sensitive adhesive layer on the surface. The silicone hybrid pressure sensitive adhesive layer contains (meth)acryloxyalkyl-functional groups, which can further react and crosslink via exposure to UV radiation (C-staged cure).

Silicone hybrid pressure sensitive adhesive and methods for its preparation and use on uneven surfaces

A photocurable silicone composition is disclosed. The composition comprises 4,5,6,7-tetrachloro-3',6&#x2032;-dihydroxy-2&#x2032;,4&#x2032;,5&#x2032;,7&#x2032;-tetraiodospiro[2-benzofuran-3,9&#x2032;-xanthen]-1-one as a photochromic pigment. The photochromic pigment is present in an amount of from about 0.001 to about 0.05 mass % of a total amount of the composition. The composition can indicate a cure point thereof by disappearance of color.

Photocurable silicone composition

A photocurable silicone composition is disclosed. The composition comprises at least one photochromic pigment. The at least one photochromic pigment is selected from the group consisting of 4,4',4&#x2033;-methylidynetris(N,N-dimethylaniline), 3,3-bis(p-dimethylaminophenyl)-6-dimethylaminophthalide, 4-4&#x2032;-benzylidenebis(N,N-dimethylaniline), 2-[(2,4-dinitrophenyl)methyl] pyridine, and combinations thereof. The at least one photochromic pigment is present in an amount of from about 0.001 to about 0.05 mass % of a total amount of the composition. The composition can indicate a cure point thereof by coloring.

The present disclosure relates to a light curable, light-heat or light-moisture dually curable, or light-heat-moisture multiple curable polyorganosiloxane composition, which has ease of synthesis, low volatile content, rapid curability, excellent toughness and/or superior optical/physical stability in a variety of fields such as coating materials, encapsulants, sealants and adhesives, a cured body obtained by curing said compositions, and an electronic device comprising the same.

Growing community of inventors

Chungcheongbuk-do, South Korea

Juyoung Yook