Google Inc.

Justin Sishung Lee

William Frank Edwards

Michael Chi Kin Lau

Madhusudan K Iyengar

Melanie Beauchemin

Zuowei Shen

Federico Pio Centola

Timothy Conrad Lee

Winnie Leung

Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.

Thermal optimizations for OSFP optical transceiver modules

An apparatus includes a housing having a bottom surface and one or more mounting members that enable the housing to be mounted in a rack. The apparatus includes liquid cooling components mounted within the housing. The liquid cooling components include tubing within which a coolant may be communicated, and a heat exchange component that thermally couples a heat load within the housing to the coolant so that heat from the heat load is transferred to the coolant. The bottom surface of the housing defines a drain path. The heat exchange component is positioned in a downward direction of gravity relative to the heat load when the housing is mounted in the rack. In the event of a coolant leak, the coolant leak will occur beneath the heat load and the coolant will flow away from the heat load and exit the housing by use of the drain path.

Inverted liquid cooling system

Growing community of inventors

Santa Clara, CA, United States of America

Justin Sishung Lee