Globalwafers Co., Ltd.

Monsanto Technology LLC

Justin Scott Kayser

John Francis Valley

James Dean Eoff

Benjamin Michael Meyer

William L Luter

Vandan Tanna

Zachary Boyer

Payman Rassoolkhani

Jeffrey Steven Morris

Felipe Camargo Rosa

Plinio Tadeu Cristofoletti, Jr

A pollen collection device for collecting pollen from crop plants grown in rows includes a housing assembly configured to be mounted on a base for being transported through a row of crop plants. The housing assembly receives at least a portion of the plants as the housing assembly is transported through the row of crop plants. An agitation assembly is attached to the housing assembly for agitating the plants as the housing assembly is transported through the row of crop plants to displace pollen from the plants. A pollen collection assembly is attached to the housing assembly for collecting the pollen displaced from the plants as the housing assembly is transported through the row of crop plants.

Device and method for pollen collection

Cleave systems for cleaving a semiconductor structure are disclosed. The cleave systems may include a cleave arm that is moveable from a starting position to a raised position in which a cleave stress is applied to the semiconductor structure. Spring members store energy as the cleave arm is raised with the stored spring energy causing the structure to cleave into two pieces upon initiation of the cleave across the structure.

Cleave systems having spring members for cleaving a semiconductor structure and methods for cleaving such structures

A method of detecting defects on a semiconductor wafer includes directing diffuse light to the semiconductor wafer and reflecting the diffuse light off of the semiconductor wafer. The method further includes detecting the diffuse light with a camera to generate an image of the semiconductor wafer and analyzing the image to detect defects on the semiconductor wafer.

Method of processing a cleaved semiconductor wafer

Cooling jacket devices of ingot puller apparatus used to prepare silicon ingots by the Czochralski method are disclosed. The cooling jacket device may include an inner shell that forms an inner chamber through which the ingot is pulled. The cooling jacket includes an outer shell. A plurality of tubes are disposed between the inner shell and outer shell. Each tube forms a cooling fluid passageway through which cooling fluid passes.

Ingot puller apparatus having cooling jacket device with cooling fluid tubes

A semiconductor wafer processing system for processing a semiconductor wafer includes a semiconductor wafer processing station for processing the semiconductor wafer and a semiconductor wafer imaging system that images the semiconductor wafer after the semiconductor wafer processing station processes the semiconductor wafer. The semiconductor wafer imaging system includes shroud panels defining a black box, a camera positioned in the black box for imaging the semiconductor wafer, and an illumination panel for directing diffuse light to the semiconductor wafer. A portion of the diffuse light is reflected off the semiconductor wafer and the camera images the semiconductor wafer by detecting the reflected diffuse light.

Cleaved semiconductor wafer imaging system

A semiconductor wafer imaging system for imaging a semiconductor wafer includes shroud panels defining a black box, a camera positioned in the black box for imaging the semiconductor wafer, and an illumination panel for directing diffuse light to the semiconductor wafer. A portion of the diffuse light is reflected off the semiconductor wafer and the camera images the semiconductor wafer by detecting the reflected diffuse light.

Cleaved semiconductor wafer camera system

Cleave systems for separating bonded wafer structures, mountable cleave monitoring systems and methods for separating bonded wafer structures are disclosed. In some embodiments, the sound emitted from a bonded wafer structure is sensed during cleaving and a metric related to an attribute of the cleave is generated. The generated metric may be used for quality control and/or to adjust a cleave control parameter to improve the quality of the cleave of subsequently cleaved bonded wafer structures.

Growing community of inventors

Wentzville, MO, United States of America

Justin Scott Kayser