Tyco Electronics Corporation

Other

Fairchild Semiconductor Corporation

Justin N Chiang

William C Beadling

Daniel Marvin Kinzer

Chung-Lin Wu

Oseob Jeon

Maria Cristina Estacio

Shou-Mean Fang

Ahmad Ashrafzadeh

James J Toth

Vijay Ullal

Michael M Dube

Adrian I Cogan

Paul Wiener

In one general aspect, a method can include forming a redistribution layer on a substrate using a first electroplating process, and forming a conductive pillar on the redistribution layer using a second electroplating process. The method can include coupling a semiconductor die to the redistribution layer, and can include forming a molding layer encapsulating at least a portion of the redistribution layer and at least a portion of the conductive pillar.

Package including a semiconductor die and a capacitive component

Apparatus related to an improved package including a semiconductor die

A composite circuit protection device includes a laminar insulating member and first and second laminar circuit protection devices. Each of the first and second laminar circuit protection devices includes (1) a first laminar electrode, (2) a second laminar electrode, (3) a laminar PTC resistive element which (i) exhibits PTC behavior, (ii) has a first face to which the first electrode is secured and an opposite second face to which the second electrode is secured, and (iii) defines first and second apertures which run between the first and second faces, (4) a third laminar conductive member which (i) is secured to the second face of the PTC resistive element in the area of the first aperture, and (ii) is spaced apart from the second electrode, (5) a fourth laminar conductive member which (i) is secured to the first face of the PTC resistive element in the area of the second aperture, and (ii) is spaced apart from the first electrode, (6) a first transverse conductive member which lies within the first aperture defined by the PTC resistive element, runs between the first and second faces of the PTC element, is secured to the PTC element, and is physically and electrically connected to the first laminar electrode and to the third laminar conductive member, but is not connected to the second laminar electrode, and (7) a second transverse conductive member which lies within the second aperture defined by the PTC resistive element, runs between the first and second faces of the PTC element, is secured to the PTC element, and is physically and electrically connected to the second laminar electrode and to the fourth laminar conductive member, but is not connected to the first laminar electrode. The first and second laminar devices are physically secured together in a stacked configuration, with the laminar insulating member between them; and the devices are connected together electrically by interfacial electrical connections between adjacent electrodes and laminar conductive members so that when an electrical power supply is connected to (i) one of the electrodes and (ii) the third or fourth laminar member on the same face of the PTC resistive element as the electrode (i), the first and second laminar circuit protection devices are connected electrically in parallel.

Electrical devices

A laminar sensor ( ) for detecting changes on a laminar substrate ( ). The sensor includes a laminar sheet ( ) which has a first surface ( ) and a second opposite surface ( ), and is made from a conductive polymer composition which exhibits temperature dependent resistance behavior, preferably PTC behavior. A plurality of sensing elements ( ) are electrically connected, preferably in series, on the sensor. Each sensing element is formed as an electrode pair containing a first electrode and a second electrode. The first and second electrodes ( ) may be on the same surface of the laminar sheet or on opposite surfaces of the sheet. Two electrical leads ( ) are present for connecting the sensing elements into a circuit, which may be used to detect changes in resistance which occur when a sensing element is exposed to an elevated temperature, a change in pressure, or a solvent.

Distributed sensor

A method and apparatus for providing a more reliable protection device and an improved PIC power integrated switch. Accordingly, the over-temperature status of the switch as well as the overcurrent status of each of a plurality of ports of the switch are detected. If there is over-temperature, ports with the overcurrent status are identified as a potential cause. These ports are then switched off. After a predetermined waiting time period during which the switch temperature is expected to decrease, the over-temperature status of the switch is again checked. If the over-temperature disappears, then the ports with non-overcurrent status remain on. However, if the over-temperature persists, then all of the ports are turned off. The improved PIC switch thus increases the dynamic operation range of the conventional PIC switch, while ensuring normal operations.

Power line protection devices and methods for providing overload protection to multiple outputs

A laminar sensor for detecting changes on a laminar substrate. The sensor includes a laminar sheet which has a first surface and a second opposite surface, and is made from a conductive polymer composition which exhibits PTC behavior. A plurality of sensing elements are electrically connected in series on the sensor. Each sensing element is formed as an electrode pair containing a first electrode and a second electrode. The first and second electrodes may be on the same surface of the laminar sheet or on opposite surfaces of the sheet. Two electrical leads are present for connecting the sensing elements into a circuit, which may be used to detect changes in resistance which occur when a sensing element is exposed to an elevated temperature, a change in pressure, or a solvent.

Sensor

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Justin N Chiang