Intel Corporation

Leatherman Tool Group, Inc.

Justin Michael Huttula

Juha Paavola

Pooya Tadayon

Mark Charles Carbone

Benjamin C Rivera

Jeff Ku

Prakash Kurma Raju

Joe F Walczyk

Gavin Sung

Arnab Sen

Mohanraj Prabhugoud

Todd L Smith

Lance Lin

Jason Y Jiang

Ruander Cardenas

Columbia Mishra

Erkan Acar

Ronald Michael Kirby

Hari Shanker Thakur

Evan Piotr Kuklinski

Youngseok Oh

Gerry Juan

Curt Matthew Kemper

Aleksander Magi

Ulun Karacaoglu

Anand S Konanur

Farid Adrangi

James M Okuley

Prosenjit Ghosh

Vivek Paranjape

Prasanna Pichumani

Daniel J Ragland

Gustavo Fricke

Shawn S Mceuen

Samarth Alva

Tim Liu

Hua Yang

Kannan G Raja

Brian A Wilk

Gokul V Subramaniam

Jerrod Peterson

Kathiravan D

Xiyong Tian

Baomin Liu

Praveen Vishakantaiah

Jia Yan Go

Twan Sing Loo

Christopher M Moore

Bala P Subramanya

Alton W Hezeltine

Ritu Bawa

Satyajit Siddharay Kamat

Chin Kung Goh

Ellann Cohen

Kari Mansukoski

Shih Wei Nien

Chun-Ting Liu

George Baoci Sun

Javed Shaikh

Cora Nien

Wan Yu Liu

Melissa Gregg

Fredrik Hamberger

Mikko Makinen

Nehakausar Pinjari

Sammi Wy Liu

Khal Ern See

Nagaraj K

A circuit board and vapor chamber are disclosed. Connectors couple the vapor chamber to a circuit board. The connectors extend from the bottom of the vapor chamber. The connectors fix the vapor chamber to the circuit board such that the bottom of the vapor chamber thermally couples to a heat source on the circuit board. The circuit board has a connector assembly that couples to the vapor chamber.

Thermal solution as an effective EMI shield

An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.

Cooling systems, cooling structures and electronic devices and methods for manufacturing or operating cooling systems, cooling structures and electronic devices

Disclosed embodiments are relate to heat transfer devices or heat exchangers for computing systems, and in particular, to heat pipes for improved thermal performance at a cold plate interface. A thermal exchange assembly includes a heat pipe (HP) directly coupled to a cold plate. The HP includes a window, which is a recessed or depressed portion of the HP. The window is attached to the cold plate at a window section of the cold plate. The cold plate is configured to be placed on a semiconductor device that generates heat during operation. The cold plate transfers the heat to the HP with less thermal resistance than existing HP solutions. Other embodiments may be described and/or claimed.

Heat pipe for improved thermal performance at cold plate interface

Modular electronic device

Particular embodiments described herein provide for an electronic device that can be configured to include a sandwich plate construction heatsink. The sandwich plate construction heatsink can include a cold plate, one or more heat pipes over the cold plate, and a top plate over the one or more heat pipes. The cold plate can include a channel to accommodate the one or more heat pipes and/or the top plate can include a channel to accommodate the one or more heat pipes. The cold plate can be over a heat source in the electronic device.

Heatsink with a sandwich plate construction

There is disclosed in one example a heat dissipator for an electronic apparatus, including: a planar vapor chamber having a substantially rectangular form factor, wherein a second dimension dof the rectangular form factor is at least approximately twice a first dimension dof the rectangular form factor; a first fan and second fan; and a first heat pipe and second heat pipe discrete from the planar vapor chamber and disposed along first and second dedges of the planar vapor chamber, further disposed to conduct heat from the first and second dedges to the first and second fan respectively.

Vapor chambers

A testing arrangement for testing Integrated Circuit (IC) interconnects is provided. In an example, the testing arrangement includes a substrate, and a first interconnect structure. The first interconnect structure may include a first member having a first end to attach to the substrate and a second end opposite the first end, and a second member having a first end to attach to the substrate and a second end opposite the first end. In some examples, the second end of the first member and the second end of the second member are to contact a second interconnect structure of a IC device under test, and the first end of the first member and the first end of the second member are coupled such that the first member and the second member are to transmit, in parallel, current to the second interconnect structure of the IC device under test.

Multi-member test probe structure

A coaxial wire interconnect architecture and associated methods are described. In one example, the coaxial wire interconnect architecture is used in a test socket interconnect array. Flexible bends are formed in one or more of the coaxial wire interconnects to provide compliant connections to an electronic device during testing.

Micro-coaxial wire interconnect architecture

An interconnect structure is provided which includes: a member having a first end coupled to a test card, and a second end opposite the first end; and a contact tip at the second end of the member, the contact tip to removably attach to another interconnect structure of a device under test, where a modulus of elasticity of the member varies along a length of the member.

Interconnect structure with varying modulus of elasticity

A shielded interconnect array and associated methods are described. Examples of the shielded interconnect array include socket connections that include conductive members with flexible bends. In examples shown, corresponding grounded conductive members with flexible bends are located adjacent to other conductive members with flexible bends to provide shielding.

Shielded interconnect array

Disclosed herein is a computing device configured to send display data to a display through a near-field communication (NFC) interface. The computing device includes a chassis, a primary display, and a near-field communication interface to transmit display data to a secondary display.

Computing device with a secondary display

A hand tool is provided that is configured to provide ready access to individual tool members. In this regard, the hand tool may provide improved features for facilitating storage and operation of the tool members. One example hand tool includes first and second jaws capable of translating between an extended position and a retracted position.

Hand tool

A hand tool is provided that is configured to provide ready access to individual tool members. In this regard, the hand tool may provide improved features for facilitating storage and operation of the tool members. One example hand tool includes first and second jaws capable of translating between an extended position and a retracted position. Such a hand tool provides a locking member configured to lock to prevent translation of the first and second jaws from the retracted position. Another example hand tool includes a tool member carried by a handle and rotatable between an open position and a stowed position. Such a hand tool provides a ramp defined on the tool member to facilitate easy rotation of the tool member to the stowed position.

According to some embodiments, a keyboard may be moved to a location behind a display.

Systems and methods to move a keyboard

Growing community of inventors

Portland, OR, United States of America

Justin Michael Huttula