Kla Corporation

Justin Lach

John Charles Robinson

David W Price

Oreste Donzella

Robert J Rathert

Chet V Lenox

Shifang Li

Stilian Pandev

Mike Von Den Hoff

Barry Saville

Thomas Groos

A die screening system may receive die-resolved metrology data for a population of dies on one or more samples from the one or more in-line metrology tools after one or more fabrication steps, where the die-resolved metrology data includes images generated using one or more measurement configurations of the one or more in-line metrology tools. In this way, the die-resolved metrology data provides many measurement channels per die, where a particular measurement channel includes data from a particular pixel of a particular image. The controller may then generate screening data for the population of dies from the die-resolved metrology data, where the screening data includes a subset of the plurality of measurement channels of the die-resolved metrology data, and screen the plurality of dies into two or more disposition classes including at least outlier dies based on variability in the screening data.

Imaging reflectometry for inline screening

Systems and methods for determining a diagnosis of a screening system are disclosed. Such systems and methods include identifying defect results based on inline characterization tool data, identifying electrical test results based on electrical test data, generating one or more correlation metrics based on the defect results and the electrical test results, and determining at least one diagnosis of the screening system based on the one or more correlation metrics, the diagnosis corresponding to a performance of the screening system.

System for automatic diagnostics and monitoring of semiconductor defect die screening performance through overlay of defect and electrical test data

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Portage, MI, United States of America

Justin Lach