Raytheon Company

Justin Kasemodel

Robert S Isom

Brian W Johansen

James M Elliott

Justin E Stroup

Allen L Kelly

Amanda M Couch

James M Irion, Ii

Darrell W Miller

John C Sherrill

Kevin Chapla

Christopher J Fisher

Randy L Smith

An apparatus and method for soldering an electrical component to a circuit board includes a stage positioning the circuit board and electrical component in alignment with a solder tip along an axis. A first spring-loaded compression mechanism maintains contact between the circuit board and the electrical component, and a second spring-loaded compression mechanism brings the soldering tip into thermal contact with the circuit board and the electrical component such that solder disposed adjacent to the circuit board and the electrical component melts. When the second spring-loaded compression mechanism removes its applied force such that the soldering tip comes out of contact with the circuit board, the first spring-loaded compression mechanism maintains the contact between the circuit board and the electrical component while the solder cools and solidifies.

System and method for creating orthogonal solder interconnects

A system for contactless testing of radio frequency apertures is provided. The system comprises a fixture having a fixture mount operable to be received in a fixture receiver of a robotic system, and a vector network analyzer ('VNA') supported by the fixture. A radiating antenna is supported by the fixture, and is operable to be connected to the VNA via a cable. Upon movement of the fixture via the robotic system, the VNA, the radiating antenna, and the cable maintain a static positional relationship relative to one another.

System for contactless testing of radio frequency apertures

Heat transfer devices and systems for thermally coupling electrical components to a heatsink can comprise one or more all-metal heat transfer device(s) thermally coupling at least one electrical component to a heatsink. A heat transfer device can comprise a metal cup attached to a metal heatsink, and a metal piston and a compliant device disposed in the cup. The piston is forcible to a secured first position, upon reflowing solder, while compressing the compliant device. Upon reflowing solder again, the compliant device causes the piston to bias and attach to the electrical component to provide an all-metal thermal path and absorb assembly tolerances to avoid using thermal gap fillers. A method is provided for thermally coupling a heatsink to a plurality of electrical components via a plurality of all-metal, expandable heat transfer devices.

Expanding thermal device and system for effecting heat transfer within electronics assemblies

An antenna is provided and includes a radiator assembly extending along a first plane, a patterned ferrite layer extending along a second plane and a band stop frequency selective surface (FSS) extending along a third plane. The third plane of the band stop FSS is axially interposed between the first plane of the radiator assembly and the second plane of the patterned ferrite layer.

Low profile, ultra-wide band, low frequency modular phased array antenna with coincident phase center

A low loss and low packaged volume coaxial RF cable according to embodiments is configured to conduct electrical signals, such as RF energy signals. The coaxial RF cable includes a three-layer structure that includes a non-conductive composite braid disposed between a first conductive composite braid and a second conductive composite braid. The coaxial cable is a ultra-flexible, compressible conductor configured to be folded multiple times within a low volume area without damage.

Low loss and low packaged volume coaxial RF cable

A transition apparatus for connecting first and second circuit boards is provided. The transition apparatus includes a beam having edges and a length defined between the edges, beam circuitry running along the length of the beam and connections disposed at the edges of the beam to connect the beam circuitry with respective circuitry of the first and second circuit boards at respective interior, opposing surfaces thereof.

Interconnect transition apparatus

An array antenna includes a modular, multi-layer, multi-balun board structure for use in feeding a dual polarization radiating element. In some embodiments, contacts on a multi-balun board structure may be directly conductively coupled to corresponding feed points of a dual polarization radiating element during antenna assembly. The multi-balun board structure may be inserted into an opening within an aperture board of an array antenna before the contacts are secured to the feed points. Dual balun board structures may be provided for some or all of the radiating elements on the aperture board.

Dual polarized array antenna with modular multi-balun board and associated methods

An antenna array system includes an antenna and a radome. The radome is disposed such that electromagnetic radiation transmitted with respect to the antenna passes through the radome. The radome includes a dielectric layer, first dielectric inclusions distributed in the dielectric layer in a first pattern and second dielectric inclusions spacially and dimensionally varied from the first dielectric inclusions and distributed in the dielectric layer in a second pattern, which is different from the first pattern.

Broadband array antenna enhancement with spatially engineered dielectrics

Wideband balun having good performance characteristics for use in feeding differential antenna elements in array antennas, balanced amplifier circuits and other applications is described. Also described is a common mode isolation circuit suitable for integration with the balun.

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McKinney, TX, United States of America

Justin Kasemodel