Raytheon Company

Justin E Stroup

Justin Kasemodel

Allen L Kelly

Amanda M Couch

Brian W Johansen

James M Irion, Ii

John C Sherrill

Christopher J Fisher

Randy L Smith

An apparatus and method for soldering an electrical component to a circuit board includes a stage positioning the circuit board and electrical component in alignment with a solder tip along an axis. A first spring-loaded compression mechanism maintains contact between the circuit board and the electrical component, and a second spring-loaded compression mechanism brings the soldering tip into thermal contact with the circuit board and the electrical component such that solder disposed adjacent to the circuit board and the electrical component melts. When the second spring-loaded compression mechanism removes its applied force such that the soldering tip comes out of contact with the circuit board, the first spring-loaded compression mechanism maintains the contact between the circuit board and the electrical component while the solder cools and solidifies.

System and method for creating orthogonal solder interconnects

A system for contactless testing of radio frequency apertures is provided. The system comprises a fixture having a fixture mount operable to be received in a fixture receiver of a robotic system, and a vector network analyzer ('VNA') supported by the fixture. A radiating antenna is supported by the fixture, and is operable to be connected to the VNA via a cable. Upon movement of the fixture via the robotic system, the VNA, the radiating antenna, and the cable maintain a static positional relationship relative to one another.

System for contactless testing of radio frequency apertures

An antenna is provided and includes a radiator assembly extending along a first plane, a patterned ferrite layer extending along a second plane and a band stop frequency selective surface (FSS) extending along a third plane. The third plane of the band stop FSS is axially interposed between the first plane of the radiator assembly and the second plane of the patterned ferrite layer.

Low profile, ultra-wide band, low frequency modular phased array antenna with coincident phase center

Growing community of inventors

McKinney, TX, United States of America

Justin E Stroup